Experimental investigation of microchannel coolers for the high heat flux thermal management of GaN-on-SiC semiconductor devices

International Journal of Heat and Mass Transfer

Volumn 50, Issue 23-24, 2007, Pages 4767-4779

  Calame, J P ^a   Myers, R E ^b   Binari, S C ^a   Wood, F N ^b   Garven, M ^b  

^a NAVAL RESEARCH LABORATORY   (United States)

^b NORTHROP GRUMMAN CORPORATION   (United States)

Author keywords

Diamond; Electronic packaging; Microchannel cooler; Single phase flow

Indexed keywords

CHEMICAL VAPOR DEPOSITION; DIAMONDS; MICROCHANNELS; POLYCRYSTALLINE MATERIALS; POWER AMPLIFIERS; SEMICONDUCTOR DEVICES; SILICON; TEMPERATURE CONTROL;

ELECTRONIC PACKAGING; MICROCHANNEL COOLER; SINGLE PHASE FLOW;

HEAT FLUX;

CHEMICAL VAPOR DEPOSITION; DIAMONDS; HEAT FLUX; MICROCHANNELS; POLYCRYSTALLINE MATERIALS; POWER AMPLIFIERS; SEMICONDUCTOR DEVICES; SILICON; TEMPERATURE CONTROL;

EID: 34848857028     PISSN: 00179310     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ijheatmasstransfer.2007.03.013     Document Type: Article

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