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Volumn 43, Issue 6, 2000, Pages

Thermal design considerations for wide bandgap transistors

Author keywords

[No Author keywords available]

Indexed keywords

ENERGY GAP; NITRIDES; POWER ELECTRONICS; SEMICONDUCTING GALLIUM COMPOUNDS; SEMICONDUCTING SILICON COMPOUNDS; SEMICONDUCTOR JUNCTIONS; SILICON CARBIDE; THERMAL EFFECTS;

EID: 0343826138     PISSN: 01926225     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article
Times cited : (13)

References (9)
  • 1
    • 0032098587 scopus 로고    scopus 로고
    • High-power 10 GHz operation of AlGaN hFETs on insulating SiC
    • June
    • G.J. Sullivan et al., "High-power 10 GHz Operation of AlGaN HFETs on Insulating SiC," IEEE Electron Device Letters, June 1998, pp. 198-200.
    • (1998) IEEE Electron Device Letters , pp. 198-200
    • Sullivan, G.J.1
  • 3
    • 0032668826 scopus 로고    scopus 로고
    • High-power microwave GaN/AlGaN HEMTs on semi-insulating sic substrates
    • April
    • S.T. Sheppard et al., "High-power Microwave GaN/AlGaN HEMTs on Semi-insulating SiC Substrates," IEEE Electron Device Letters, April 1999, pp. 161-163.
    • (1999) IEEE Electron Device Letters , pp. 161-163
    • Sheppard, S.T.1
  • 4
    • 0028714957 scopus 로고
    • Thermal modeling, measurements and design considerations of GaAs microwave devices
    • D. Dawson, "Thermal Modeling, Measurements and Design Considerations of GaAs Microwave Devices," IEEE GaAs Symposium Proceedings, 1994, pp. 285-290.
    • (1994) IEEE GaAs Symposium Proceedings , pp. 285-290
    • Dawson, D.1
  • 5
    • 0343624515 scopus 로고    scopus 로고
    • Cree Research Inc.
    • Private conversation, Dr. Scott Allen, Cree Research Inc.
    • Allen, S.1
  • 6
    • 0032683491 scopus 로고    scopus 로고
    • 1-8 GHz GaN-based power amplifier using flip-chip bonding
    • July
    • J.J. Xu et al., "1-8 GHz GaN-based Power Amplifier Using Flip-chip Bonding," IEEE Microwave and Guided Wave Letters, July 1999, pp. 277-279.
    • (1999) IEEE Microwave and Guided Wave Letters , pp. 277-279
    • Xu, J.J.1
  • 7
    • 0033709654 scopus 로고    scopus 로고
    • Microwave flip chip and BGA technology
    • J. Bedinger, "Microwave Flip Chip and BGA Technology," IEEE MTT-S 2000.
    • (2000) IEEE MTT-S
    • Bedinger, J.1
  • 8
    • 0032299491 scopus 로고    scopus 로고
    • RF and mechanical characterization of flip-chip interconnect
    • December
    • Zhang et al., "RF and Mechanical Characterization of Flip-chip Interconnect," IEEE MTT, December 1998, p. 2269-2275.
    • (1998) IEEE MTT , pp. 2269-2275
  • 9
    • 0031268156 scopus 로고    scopus 로고
    • Measurement of piezoelectrically induced charge in GaN/AlGaN heterostructure field-effect transistors
    • November
    • E.T. Yu et al., "Measurement of Piezoelectrically Induced Charge in GaN/AlGaN Heterostructure Field-effect Transistors," Applied Physics Letters, November 1997, pp. 2794-2796.
    • (1997) Applied Physics Letters , pp. 2794-2796
    • Yu, E.T.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.