A comparative analysis of studies on heat transfer and fluid flow in microchannels

Microscale Thermophysical Engineering

Volumn 5, Issue 4, 2001, Pages 293-311

  Sobhan, Choondal B ^a   Garimella, Suresh V ^a  

^a PURDUE UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0035470863     PISSN: 10893954     EISSN: None     Source Type: Journal    
DOI: 10.1080/10893950152646759     Document Type: Article

References (71)

1. D. B. Tuckerman and R. F. W. Pease. High-Performance Heat Sinking for VLSI, IEEE Electron. Device Lett., vol. EDL-2, pp. 126-129, 1981.
2. D. B. Tuckerman and R. F. W. Pease. Ultrahigh Thermal Conductance Microstructures for Cooling Integrated Circuits, Procs. 32nd Electronics Components Conf., IEEE, EIA, CHMT, pp. 145-149, 1982.
3. P. Y. Wu and W. A. Little. Measurement of Friction Factor for the Flow of Gases in Very Fine Channels Used for Micro Miniature Joule Thompson Refrigerators, Cryogenics, vol. 23, pp. 273-277, 1983.
4. P. Y. Wu and W. A. Little. Measurement of the Heat Transfer Characteristics of Gas Flow in Fine Channel Heat Exchangers for Micro Miniature Refrigerators, Cryogenics, vol. 24, pp. 415-420, 1984.
5. M. Mahalingam and J. Andrews. High Performance Air Cooling for Microelectronics, Procs. Int. Symp. on Cooling Technology for Electronic Equipment, Honolulu, HI, pp. 608-625, 1987.
6. R. J. Phillips, L. R. Glicksman, and R. Larson. Forced Convection, Liquid-Cooled, Microchannel Heat Sinks for High-Power-Density Microelectronics, Procs. Int. Symp. Cooling Technology for Electronic Equipment, Honolulu, HI, pp. 227-248, 1987.
7. J. Pfahler, J. Harley, H. H. Bau, and J. Zemel. Liquid Transport in Micron and Submicron Channels, J. Sensors Actuators A, vol. 21-23, pp. 431-434, 1990.
8. T. L. Hoopman. Microchanneled Structures, Microstruct., Sensors Actuators, ASME DSC-108, pp. 171-174, 1990.
9. S. B. Choi, R. F. Barron, and R. O. Warrington. Fluid Flow and Heat Transfer in Microtubes, Micromech. Sensors, Actuators Syst., ASME DSC-Vol.32, pp. 123-134, 1991.
10. M. M. Rahman and F. Gui. Experimental Measurements of Fluid Flow and Heat Transfer in Microchannel Cooling Passages in a Chip Substrate, Adv. Electron. Packaging, ASME EEP-Vol. 4-2, pp. 685-692.
11. X. F. Peng and B. X. Wang. Forced Convection and Flow Boiling Heat Transfer for Liquid Flowing through Microchannels, Int. J. Heat Mass Transfer, vol. 14, pp. 3421-3427, 1993.
12. B. X. Wang and X. F Peng. Experimental Investigation on Liquid Forced Convection Heat Transfer through Microchannels, Int. J. Heat Mass Transfer, vol. 37, suppl. 1, pp. 73-82, 1994.
13. X. F. Peng, G. P. Peterson, and B. X. Wang. Frictional Flow Characteristics of Water Flowing through Microchannels, Exp. Heat Transfer, vol. 7, pp. 249-264, 1994.
14. X. F. Peng, G. P. Peterson, and B. X. Wang. Heat Transfer Characteristics of Water Flowing through Microchannels, Exp. Heat Transfer, vol. 7, pp. 265-283, 1994.
15. X. F. Peng and G. P. Peterson. The Effect of Thermofluid and Geometrical Parameters on Convection of Liquids Through Rectangular Microchannels, Int. J. Heat Mass Transfer, vol. 38, pp. 755-758, 1995.
16. X. F. Peng and G. P. Peterson. Convective Heat Transfer and Flow Friction for Water Flow in Microchannel Structures, Int. J. Heat Mass Transfer, vol. 39, pp. 2599-2608, 1996.
17. X. F. Peng and G. P. Peterson. Forced Convection Heat Transfer of Single Phase Binary Mixtures through Microchannels, Exp. Thermal Fluid Sci., vol. 12, pp. 98-104, 1996.
18. T. M. Harms, M. Kazmierczak, F. M. Gerner, A. Holke, H. T. Henderson, J. Pilchowski, and K. Baker. Experimental Investigation of Heat Transfer and Pressure Drop through Deep Microchannels in a (110) Silicon Substrate, ASME HTD-Vol.351-1, pp. 347-357, 1997.
19. Y. Zhuang, C. F. Ma, and M. Qin. Experimental Study on Local Heat Transfer with Liquid Impingement Flow in Two-Dimensional Micro-Channels, Int. J. Heat Mass Transfer, vol. 40, pp. 4055-4059, 1997.
20. T. M. Adams, S. I. Abdel-Khalik, S. M. Jeter, and Z. H. Qureshi. An Experimental Investigation Of Single-Phase Forced Convection in Microchannels, Int. J Heat Mass Transfer, vol. 41, pp. 851-857, 1998.
21. T. M. Adams, M. F. Dowling, S. I. Abdel-Khalik, and S. M. Jeter. Applicability of Traditional Turbulent Single Phase Forced Convection Correlations to Non-Circular Microchannels, Int. J. Heat Mass Transfer, vol. 42, pp. 4411-4415, 1999.
22. C. P. Tso and S. P. Mahulikar. Use of the Brinkman Number for Single Phase Forced Convective Heat Transfer in Microchannels, Int. J. Heat Mass Transfer, vol. 41, pp. 1759-1769, 1998.
23. C. P. Tso and S. P. Mahulikar. Role of the Brinkman Number in Analyzing Flow Transitions in Microchannels, Int. J. Heat Mass Transfer, vol. 42, pp. 1813-1833, 1999.
24. C. P. Tso and S. P. Mahulikar. Experimental Verification of the Role of Brinkman Number in Microchannels Using Local Parameters, Int. J. Heat Mass Transfer, vol. 43, pp. 1837-1849, 2000.
25. H. B. Ma, G. P. Peterson, and X. J. Lu. Influence of Vapor-Liquid Interactions on the Liquid Pressure Drop in Triangular Microgrooves, Int. J. Heat Mass Transfer, vol. 37, pp. 2211-2219, 1994.
26. M. B. Kleiner, S. A. Kuehn, and K. Haberger. High Performance Forced Air Cooling Scheme Employing Microchannel Heat Exchangers, IEEE Trans. Components, Packaging Manuf. Technol. A, vol. 18, pp. 795-804, 1995.
27. K. Takamatsu, N. Fujimoto, Y. F. Rao, and K. Fukuda. Numerical Study of Flow and Heat Transfer of Superfluid Helium in Capillary Channels, Cryogenics, vol. 37, pp. 829-835, 1997.
28. D. Copeland, M. Behnia, and W. Nakayama. Manifold Microchannel Heat Sinks: Isothermal Analysis, IEEE Trans. Components, Packaging, Manuf. Technol. A, vol. 20, pp. 96-102, 1997.
29. G. M. Mala, D. Li, and J. D. Dale. Heat Transfer and Fluid Flow in Microchannels, Int. J. Heat Mass Transfer, vol. 40, pp. 3079-3088, 1997.
30. G. M. Mala, D. Li, C. Werner, H. J. Jacobasch, and Y. B. Ning. Flow Characteristics of Water through a Microchannel between Two Parallel Plates with Electrokinetic Effects, Int. J. Heat Fluid Flow, vol. 18, pp. 489-496, 1997.
31. C. Yang, D. Li, and J. H. Masliyah. Modeling Forced Liquid Convection in Rectangular Microchannels with Electrokinetic Effects, Int. J. Heat Mass Transfer, vol. 41, pp. 4229-4249, 1998.
32. H. H. Bau. Optimization of Conduits' Shape in Microscale Heat Exchangers, Int. J. Heat Mass Transfer, vol. 41, pp. 2717-2723, 1998.
33. D. Y. Lee and K. Vafai. Comparative Analysis of Jet Impingement and Microchannel Cooling for High Heat Flux Applications, Int. J. Heat Mass Transfer, vol. 42, pp. 1555-1568, 1999.
34. E. B. Arkilic, K. S. Breuer, and M. A. Schmidt. Gaseous Flow in Microchannels, Application of Microfabrication to Fluid Mechanics, ASME FED-Vol. 197, pp. 57-66, 1994.
35. E. B. Arkilic, M. A. Schmidt, and K. S. Breuer. Gaseous Slip Flow in Long Microchannels, IEEE J. Microelectromech. Syst., vol. 6, pp. 167-178, 1997.
36. D. Yu, R. Warrington, R. Barron, and T. Ameel. An Experimental and Theoretical Investigation of Fluid Flow and Heat Transfer in Microtubes, ASME/JSME Thermal Eng. Conf, vol. 1, pp. 523-530, 1995.
37. C. Mavriplis, J. C. Ahn, and R. Goulard. Heat Transfer and Flow Fields in Short Microchannels Using Direct Simulation Monte Carlo, AIAA J. Thermophys. Heat Transfer, vol. 11, pp. 489-496, 1997.
38. J. Pfahler, J. Harley, H. H. Bau, and J. Zemel. Gas and Liquid Flow in Small Channels, Micromech. Sensors, Actuators Syst., ASME DSC-32, pp. 49-60, 1991.
39. H. P. Kavehpour, M. Faghri, and Y. Asako. Effects of Compressibility and Rarefaction on Gaseous Flows in Microchannels, Numer. Heat Transfer A, vol. 32, pp. 677-695, 1997.
40. Z. Y. Guo and X. B. Wu. Compressibility Effect on the Gas Flow and Heat Transfer in a Micro Tube, Int. J. Heat Mass Transfer, vol. 40, pp. 3251-3254, 1997.
41. C. S. Chen, S. M. Lee, and J. D. Sheu. Numerical Analysis of Gas Flow in Microchannels, Numer. Heat Transfer A, vol. 33, pp. 749-761, 1998.
42. Y. Y. Niu. Navier-Stokes Analysis of Gaseous Slip Flow in Long Grooves, Numer. Heat Transfer A, vol. 36, pp. 75-93, 1999.
43. M. B. Bowers and I. Mudawar. Two Phase Electronic Cooling Using Mini-channel and Microchannel Heat Sinks. Part 1 : Design Criteria and Heat Diffusion Constraints, ASME J. Electron. Packaging, vol. 116, pp. 290-297, 1994.
44. M. B. Bowers and I. Mudawar. Two Phase Electronic Cooling Using Mini-channel and Microchannel Heat Sinks. Part 2: Flow Rate and Pressure Drop Constraints, ASME J. Electron. Packaging, vol. 116, pp. 298-305, 1994.
45. M. B. Bowers and I. Mudawar. High Flux Boiling in Low Flow Rate, Low Pressure Drop Mini-channel and Micro-channel Heat Sinks, Int. J. Heat Mass Transfer, vol. 37, pp. 321-332, 1994.
46. X. F. Peng, B. X. Wang, G. P. Peterson, and H. B. Ma. Experimental Investigation of Heat Transfer in Flat Plates with Rectangular Microchannels, Int. J. Heat Mass Transfer, vol. 38, pp. 127-137, 1995.
47. X. F. Peng, G. P. Peterson, and B. X. Wang. Flow Boiling of Binary Mixtures in Microchannel Plates, Int. J. Heat Mass Transfer, vol. 39, pp. 1257-1264, 1996.
48. X. F. Peng, H. Y. Hu, and B. X. Wang. Flow Boiling through V-shape Microchannels, Exp. Heat Transfer, vol. 11, pp. 87-90, 1998.
49. J. M. Ha and G. P. Peterson. The Interline Heat Transfer of Evaporating Thin Films along a Micro Grooved Surface, ASME J. Heat Transfer, vol. 118, pp. 747-755, 1996.
50. J. M. Ha and G. P. Peterson. Capillary Performance of Evaporating Flow in Microgrooves - An Analytical Approach for Very Small Tilt Angles, ASME J. Heat Transfer, vol. 120, pp. 452-457, 1998.
51. G. M. Roach, Jr., S. I. Abdel-Khalik, S. M. Ghiaasiaan, M. F. Dowling, and S. M. Jeter. Low-Flow Critical Heat Flux in Heated Microchannels, Nuclear Sci. Eng., vol. 131, pp. 411-425, 1999.
52. G. P. Celata, M. Cumo, and A. Mariani. Burnout in Highly Subcooled Water Flow Boiling in Small Diameter Tubes, Int. J. Heat Mass Transfer, vol. 36, pp. 1269-1285, 1993.
53. R. Mertz, A. Wein, and M. Groll. Experimental Investigation of Flow Boiling Heat Transfer in Narrow Channels, Heat Technol., vol. 14, pp. 47-54, 1996.
54. J. C. Sturgis and I. Mudawar. Critical Heat Flux in a Long, Rectangular Channel Subjected to One-Sided Heating - I. Flow Visualization, Int. J. Heat Mass Transfer, vol. 42, pp. 1835-1847, 1999.
55. J. C. Sturgis and I. Mudawar. Critical Heat Flux in a Long, Rectangular Channel Subjected to One-Sided Heating - II. Analysis of Critical Heat Flux Data, Int. J. Heat Mass Transfer, vol. 42, pp. 1849-1862, 1999.
56. J. M. Cuta, C. E. McDonald, and A. Shekarriz. Forced Convection Heat Transfer in Parallel Channel Array Microchannel Heat Exchanger, Advances in Energy Efficiency, Heat/Mass Transfer Enhancement, ASME PID-Vol.2/HTD-Vol. 338, pp. 17-23, 1996.
57. T. S. Ravigururajan. Impact of Channel Geometry on Two Phase Flow Heat Transfer Characteristics of Refrigerants in Microchannel Heat Exchangers, ASME J. Heat Transfer, vol. 120, pp. 485-491, 1998.
58. K. A. Triplett, S. M. Ghiaasiaan, S. I. Abdel-Khalik, and D. L. Sadowski. Gas-Liquid Two Phase Flow in Microchannels. Part I: Two Phase Flow Patterns, Int. J. Multiphase Flow, vol. 25, pp. 377-394, 1999.
59. K. A. Triplett, S. M. Ghiaasiaan, S. I. Abdel-Khalik, A. LeMouel, and B. N. McCord. Gas-Liquid Two Phase Flow in Microchannels. Part II: Void Fraction and Pressure Drop, Int. J. Multiphase Flow, vol. 25, pp. 395-410, 1999.
60. J. W. Coleman and S. Garimella. Characterization of Two-Phase Flow Patterns in Small Diameter Round and Rectangular Tubes, Int. J. Heat Mass Transfer, vol. 42, pp. 2869-2881, 1999.
61. D. B. Tuckerman. Heat Transfer Microstructures for Integrated Circuits, Ph.D. thesis, Stanford University, Stanford, CA, 1984.
62. A. Weisberg, H. H. Bau, and J. Zemel. Analysis of Microchannels for Integrated Cooling, Int. J. Heat Mass Transfer, vol. 35, pp. 2465-2474, 1992.
63. S. K. Roy and B. L. Avanik. Very High Heat Flux Microchannel Heat Exchanger for Cooling of Semiconductor Laser Diode Arrays, IEEE Trans. Components, Packaging Manuf. Technol. B: Adv. Packaging, vol. 19, pp. 444-451, 1996.
64. A. Aranyosi, L. M. R. Bolle, and H. A. Buyse. Compact Air-Cooled Heat Sinks for Power Packages, IEEE Trans. Components, Packaging Manuf. Technol. A, vol. 20, pp. 442-451, 1997.
65. C. Perret, C. Schaeffer, and J. Boussey. Microchannel Integrated Heat Sinks in Silicon Technology, IEEE Industry Applications Society Annual Meeting, Vol. 2, 98CH36242, pp. 1051-1055, 1998.
66. C. Gillot, C. Schaeffer, and A. Bricard. Integrated Micro Heat Sink for Power Multichip Module, IEEE Industry Applications Society Annual Meeting, Vol. 2, 98CH36242, pp. 1046-1050, 1998.
67. C. Gillot, L. Meysenc, and C. Schaeffer. Integrated Single and Two Phase Micro Heat Sinks under IGBT Chips, IEEE Trans. on Components Packaging Technol., vol. 22, pp. 384-389, 1999.
68. S. Yu, T. Ameel, and M. Xin. An Air-Cooled Microchannel Heat Sink with High Heat Flux and Low Pressure Drop, Proc. 33rd Natl. Heat Transfer Conf., Albuquerque, NM, pp. 1-7, 1999.
69. M. Richter, P. Woias, and D. Weiss. Microchannels for Applications in Liquid Dosing and Flow-Rate Measurement, Sensors Actuators A, vol. 62, pp. 480-483, 1997.
70. C. D. Meinhart, S. T. Wereley, and J. G. Santiago. PIV Measurements of a Microchannel Flow, Exp. Fluids, vol. 27, pp. 414-419, 1999.
71. V. Gnielinski. New Equations for Heat and Mass Transfer in Turbulent Pipe and Channel Flow, Int. Chem. Eng., vol. 16, pp. 359-368, 1976.