RF characterization of flip-chip anisotropic conductive adhesives joints

2006 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'06

Volumn , Issue , 2006, Pages 213-217

  Wang, Xu ^a   Cheng, Zhaonian ^a   Liu, Johan ^a,b  

^a SHANGHAI UNIVERSITY   (China)

^b CHALMERS UNIVERSITY OF TECHNOLOGY   (Sweden)

Author keywords

[No Author keywords available]

Indexed keywords

ANISOTROPY; CHARACTERIZATION; COMPUTER SIMULATION; COMPUTER SOFTWARE; FINITE DIFFERENCE METHOD; FLIP CHIP DEVICES; OPTIMIZATION; TIME DOMAIN ANALYSIS;

ADHESIVES JOINTS; ELECTROMAGNETIC SOFTWARE; EQUIVALENT LUMPED CIRCUITS;

ADHESIVE JOINTS;

EID: 34250800419     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (20)

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