Over 10 GHz equivalent circuit model of ACF flip-chip interconnect using Ni-filled ball and Au-coated polymer balls

Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium

Volumn , Issue , 1999, Pages 421-425

  Alan, Seungyoung ^a   Ryu, Woonghwan ^a   Yim, Myung Jin ^a   Lee, Junho ^a   Jeon, Young Doo ^a   Kim, Woopoung ^a   Paik, Kyung Wook ^a   Kim, Joungho ^a  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC NETWORK ANALYSIS; EQUIVALENT CIRCUITS; FLIP CHIP DEVICES; INTEGRATED CIRCUIT MANUFACTURE; INTERCONNECTION NETWORKS; SEMICONDUCTOR DEVICE MODELS;

ANISOTROPIC CONDUCTIVE FILM (ACF) FLIP-CHIP INTERCONNECTS; EQUIVALENT CIRCUIT MODEL;

ELECTRONICS PACKAGING;

EID: 0033341147     PISSN: 10898190     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)