High volume, low cost flip chip assembly on polyester flex

Circuit World

Volumn 25, Issue 2, 1999, Pages 11-17

  Gilleo, Ken ^a   Boyes, Bob ^a   Corbett, Steve ^a   Larson, Gary ^a   Price, Dave ^a  

^a Assembly Materials Group   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES; ASSEMBLY; CONDUCTIVE MATERIALS; PLASTIC FILMS; POLYESTERS; PRINTED CIRCUIT BOARDS; PRINTED CIRCUIT MANUFACTURE; SUBSTRATES; SURFACE MOUNT TECHNOLOGY; THICK FILMS;

CONDUCTIVE ADHESIVES; FLEXIBLE CIRCUITS; POLYMER THICK FILM;

FLIP CHIP DEVICES;

EID: 0033299797     PISSN: 03056120     EISSN: None     Source Type: Journal    
DOI: 10.1108/03056129910733542     Document Type: Article

References (0)