Anisotropic conductive adhesion of microsensors applied in the instance of a low pressure sensor

Sensors and Actuators, A: Physical

Volumn 97-98, Issue , 2002, Pages 323-328

  Briegel, R ^a   Ashauer, M ^a   Ashauer, H ^a   Sandmaier, H ^a,b   Lang, W ^a  

^a Hahn Schickard Gesellschaft   (Germany)

^b UNIVERSITY OF STUTTGART   (Germany)

Author keywords

Anisotropic conductive adhesive; Flip chip; Microsensor assembly; Pressure sensor

Indexed keywords

ADHESION; ANISOTROPY; ASSEMBLY; BONDING; FLIP CHIP DEVICES; LIQUID CRYSTAL DISPLAYS; TEMPERATURE;

ANISOTROPIC CONDUCTIVE ADHESIVE; PRESSURE SENSOR;

MICROSENSORS;

EID: 0036544162     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0924-4247(01)00845-7     Document Type: Conference Paper

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