Corrosion-resistant anisotropic conductive adhesive for consumer electronic applications

Proceedings - 2008 International Symposium on Microelectronics, IMAPS 2008

Volumn , Issue , 2008, Pages 453-459

  Xia, Bo ^a   Shah, Jayesh ^a   O'Hara, Wanda ^a  

^a HENKEL CORPORATION   (United States)

Author keywords

Anisotropic conductive adhesive; Corrosion resistant; RFID

Indexed keywords

ANISOTROPIC CONDUCTIVE ADHESIVES; ANISOTROPIC CONDUCTIVE FILMS; ANISOTROPIC CONDUCTIVE PASTES; CORROSION-RESISTANT; ELECTRONIC APPLICATION; EMERGING APPLICATIONS; PROCESSING TEMPERATURE; SEMICONDUCTOR PACKAGES;

ANISOTROPY; CORROSION RESISTANCE; CURING; ELECTRONICS PACKAGING; FLAT PANEL DISPLAYS; LEAD; MICROELECTRONICS; OPTIMIZATION; RADIO FREQUENCY IDENTIFICATION (RFID); TEMPERATURE;

ADHESIVE JOINTS;

EID: 84876922863     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)

1. th International Microelectronics Conference, pp. 324-327, 1996
2. th IEEE/CPMT, pp. 36-41, 1999
3. Y.P. Wu et al., "Impact Properties of Flip Chip Interconnection Using Anisotropically Conductive Film on the Glass and Flexible Substrate", 2003 Electronic Components and Technology Conference, Pp.544-548
4. J. Shah et al., "Development of isotropic Conductive Adhesive for Metallic Antenna", Smart Labels USA, March, 2006, Boston
5. RFID tag assembly equipment using flip die assembly approach is available from Muhlbauer AG (www.muhlbauer.com/), Tyco Electronics (www.tycoelectronics. com/), and Toray Engineering (www.toray-eng.com/).