Thermal characterization of high-density interconnects in the form of equivalent thermal conductivity

Proceedings of the ASME InterPack Conference 2009, IPACK2009

Volumn 2, Issue , 2010, Pages 297-310

  Nakayama, Wataru ^a   Koizumi, Katsuhiro ^b   Fukue, Takashi ^c   Ishizuka, Masaru ^c   Nakajima, Tatsuya ^d   Koike, Hiroko ^e   Matsuki, Ryuichi ^e  

^a ThermTech International   (Japan)

^b Customer Service Engineering Department   (Japan)

^c TOYAMA PREFECTURAL UNIVERSITY   (Japan)

^d SIEMENS AG   (Germany)

^e SHINKO ELECTRIC INDUSTRIES CO LTD   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ANALYSIS SYSTEM; COMPUTATIONAL RESOURCES; CROSS-WIRE; EQUIVALENT CONDUCTIVITY; EQUIVALENT THERMAL; HEAT FLOWS; HEAT-CONDUCTION ANALYSIS; HIGH DENSITY INTERCONNECTS; HIGH-DENSITY; METAL CONTENT; METAL PATTERNS; NUMERICAL SOLUTION; REPRESENTATIVE VOLUME ELEMENTS; TEMPLATE MODELS; THERMAL CHARACTERIZATION; THERMAL MODELING;

FLOW MEASURING INSTRUMENTS; HEAT CONDUCTION; HEAT FLUX; METALS; NUMERICAL ANALYSIS; PRINTED CIRCUIT DESIGN; THERMAL CONDUCTIVITY; THERMOANALYSIS;

METAL ANALYSIS;

EID: 77953928263     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/InterPACK2009-89086     Document Type: Conference Paper

References (13)

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