Heat conduction in printed circuit boards - Part II; small PCBs connected to large thermal mass at their edge

2007 Proceedings of the ASME InterPack Conference, IPACK 2007

Volumn 2, Issue , 2007, Pages 653-661

  Nakayama, Wataru ^a   Nakajima, Tatsuya ^b   Koike, Hiroko ^c   Matsuki, Ryuichi ^c  

^a ThermTech International   (Japan)

^b SIEMENS AG   (Germany)

^c SHINKO ELECTRIC INDUSTRIES CO LTD   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

CONVECTIVE HEAT TRANSFER; HEAT CONDUCTION ANALYSIS; THERMAL MASS;

BOUNDARY CONDITIONS; ELECTRONICS PACKAGING; HEAT CONDUCTION; HEAT SINKS; THERMAL CONDUCTIVITY;

PRINTED CIRCUIT BOARDS;

EID: 40449098965     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/IPACK2007-33606     Document Type: Conference Paper

References (7)