Analysis of thermal vias in high density interconnect technology

Proceedings - IEEE Semiconductor Thermal and Temperature Measurement Symposium

Volumn , Issue , 1992, Pages 55-61

  Lee, S ^a   Lemczyk, T F ^a   Yovanovich, M M ^a  

^a NONE

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER AIDED ANALYSIS; HEAT TRANSFER--MATHEMATICAL MODELS; MATHEMATICAL MODELS;

CHIPS; COMPUTED PREDICTIONS; HEAT REMOVAL; HIGH DENSITY INTERCONNECT TECHNOLOGY; THERMAL MODELING; VIA NETWORKS;

ELECTRONIC EQUIPMENT;

EID: 0026810890     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)