Heat conduction in printed circuit boards: A mesoscale modeling approach

Journal of Electronic Packaging

Volumn 130, Issue 4, 2008, Pages 0411061-04110610

  Nakayama, Wataru ^a  

^a ThermTech International   (Japan)

Author keywords

Analytical modeling; Copper rein laminate; Heat conduction; Printed circuit board; Through vias

Indexed keywords

ANALYTICAL MODELS; BALL GRID ARRAYS; COPPER; ELECTRONICS PACKAGING; HEAT CONDUCTION; TIMING CIRCUITS;

ANALYTICAL MODELING; BALL-GRID ARRAYS; COOLING AIR; COPPER/REIN LAMINATE; COVERED AREAS; EXPOSED TO; HEAT TRANSFER PERFORMANCE; MESO-SCALE MODELING; MODELING APPROACH; THROUGH-VIAS;

PRINTED CIRCUIT BOARDS;

EID: 58149234102     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.2993126     Document Type: Conference Paper

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