Thermal modeling and performance of high heat flux SOP packages

IEEE Transactions on Advanced Packaging

Volumn 27, Issue 2, 2004, Pages 398-412

  Arik, Mehmet ^a   Garg, Jivtesh ^a   Bar Cohen, Avram ^b  

^a GE GLOBAL RESEARCH   (United States)

^b UNIVERSITY OF MARYLAND   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COOLING SYSTEMS; DIELECTRIC MATERIALS; FINITE ELEMENT METHOD; HEAT FLUX; HEAT LOSSES; HEAT RESISTANCE; MULTICHIP MODULES; SEMICONDUCTING ORGANIC COMPOUNDS; SEMICONDUCTOR DEVICE MODELS; SEMICONDUCTOR DEVICE STRUCTURES; TEMPERATURE DISTRIBUTION; THERMAL CONDUCTIVITY;

COMPACT MODEL; HIGH FLUX; LIQUID COOLING; SYSTEM-ON-PACKAGE;

CHIP SCALE PACKAGES;

EID: 4544349710     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/TADVP.2004.828816     Document Type: Article

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