Heat conduction in printed circuit boards - Part I; overview and the case of a jedec test board

2007 Proceedings of the ASME InterPack Conference, IPACK 2007

Volumn 2, Issue , 2007, Pages 645-652

  Nakayama, Wataru ^a   Nakajima, Tatsuya ^b   Koike, Hiroko ^c   Matsuki, Ryuichi ^c  

^a ThermTech International   (Japan)

^b SIEMENS AG   (Germany)

^c SHINKO ELECTRIC INDUSTRIES CO LTD   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ANALYTICAL COMPOSITE ANALYSIS; TEMPERATURE PREDICTION; THERMAL MASS;

BOUNDARY CONDITIONS; ELECTRONICS PACKAGING; HEAT CONDUCTION; THERMAL CONDUCTIVITY; THERMOANALYSIS;

PRINTED CIRCUIT BOARDS;

EID: 40449083129     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/IPACK2007-33605     Document Type: Conference Paper

References (17)