-
1
-
-
0002647466
-
Silicon piezoresistive stress sensors and their application in electronic packaging
-
PII S1530437X01041379
-
Suhling, J., and Jaeger, R., 2001. "Silicon Piezoresistive Stress Sensors and their Application in Electronic Packaging". IEEE Sensors Journal, 1(1), pp. 14-30. (Pubitemid 33778156)
-
(2001)
IEEE Sensors Journal
, vol.1
, Issue.1
, pp. 14-30
-
-
Suhling, J.C.1
Jaeger, R.C.2
-
2
-
-
0033352439
-
In-situ stress state measurements during chip-on-board assembly
-
DOI 10.1109/6104.755088
-
Zou, Y., Suhling, J., Johnson, R., Jaeger, R., and Mian, A., 1999. "In-Situ Stress State Measurements During Chip-on-Board Assembly". IEEE Transactions on Electronics Packaging Manufacturing, 22(1), pp. 38-52. (Pubitemid 30559437)
-
(1999)
IEEE Transactions on Electronics Packaging Manufacturing
, vol.22
, Issue.1
, pp. 38-52
-
-
Zou, Y.1
Suhling, J.C.2
Wayne Johnson, R.3
Jaeger, R.C.4
Mian, A.K.M.5
-
3
-
-
27644466411
-
Die Stress Characterization in Flip Chip on Laminate Assemblies
-
Rahim, M., Suhling, J., Copeland, D., Islam, M., Jaeger, R., Lall, P., and Johnson, R., 2005. "Die Stress Characterization in Flip Chip on Laminate Assemblies". IEEE Transactions on Components and Packaging Technologies, 28(3), pp. 415-429.
-
(2005)
IEEE Transactions on Components and Packaging Technologies
, vol.28
, Issue.3
, pp. 415-429
-
-
Rahim, M.1
Suhling, J.2
Copeland, D.3
Islam, M.4
Jaeger, R.5
Lall, P.6
Johnson, R.7
-
4
-
-
35348841447
-
Continuous In-Situ Die Stress Measurements during Thermal Cycling Accelerated Life Testing
-
Rahim, M., Roberts, J., Suhling, J., Jaeger, R., and Lall, P., 2007. "Continuous In-Situ Die Stress Measurements During Thermal Cycling Accelerated Life Testing". In Proc. 57th Electronic Components and Technology Conference ECTC '07, pp. 1478-1489.
-
(2007)
Proc. 57th Electronic Components and Technology Conference ECTC '07
, pp. 1478-1489
-
-
Rahim, M.1
Roberts, J.2
Suhling, J.3
Jaeger, R.4
Lall, P.5
-
5
-
-
32244433946
-
Piezo-FET stress-sensor arrays for wire-bonding characterization
-
DOI 10.1109/JMEMS.2005.863702
-
Doelle, M., Peters, C., Ruther, P., and Paul, O., 2006. "Piezo-FET Stress-Sensor Arrays for Wire-Bonding Characterization". Journal of Micro electromechanical Systems, 15(1), pp. 120-130. (Pubitemid 43210796)
-
(2006)
Journal of Microelectromechanical Systems
, vol.15
, Issue.1
, pp. 120-130
-
-
Doelle, M.1
Peters, C.2
Ruther, P.3
Paul, O.4
-
6
-
-
65949119447
-
Flip-Chip Packaging Technology for Enabling 45 nm Products
-
June
-
Agraharam, S., Deshpande, N., Jackson, J., Mahajan, R., Manepalli, R., Pang, M., Patel, N., Stover, P., Tanikella, R., Tiwari, P., and Wakharkar, 2008. "Flip-Chip Packaging Technology for Enabling 45 nm Products". Intel Technology Journal, 12(02), June, pp. 145-156.
-
(2008)
Intel Technology Journal
, vol.12
, Issue.2
, pp. 145-156
-
-
Agraharam, S.1
Deshpande, N.2
Jackson, J.3
Mahajan, R.4
Manepalli, R.5
Pang, M.6
Patel, N.7
Stover, P.8
Tanikella, R.9
Tiwari, P.10
Wakharkar11
-
7
-
-
50249176423
-
A Review of First Level Interconnect Modeling Methodology
-
Dimagiba, R., Ganapathysubramanian, S., and Modi, M., 2006. "A Review of First Level Interconnect Modeling Methodology". In Proc. International Conference on Electronics Manufacturing and Technology, pp. 529-533.
-
(2006)
Proc. International Conference on Electronics Manufacturing and Technology
, pp. 529-533
-
-
Dimagiba, R.1
Ganapathysubramanian, S.2
Modi, M.3
-
8
-
-
33644914216
-
The continuous spinning current (CSC) stress sensor method for the extraction of two stress components in an offset compensated manner
-
March
-
Bartholomeyczik, J., Doelle, M., Ruther, P., and Paul, O., 2006. "The continuous spinning current (CSC) stress sensor method for the extraction of two stress components in an offset compensated manner". Sensors and Actuators A: Physical, 127(2), March, pp. 255-260.
-
(2006)
Sensors and Actuators A: Physical
, vol.127
, Issue.2
, pp. 255-260
-
-
Bartholomeyczik, J.1
Doelle, M.2
Ruther, P.3
Paul, O.4
-
9
-
-
0028060727
-
A (100) Silicon Stress Test Chip with Optimized Piezoresistive Sensor Rosettes
-
Jaeger, R., Suhling, J., and Anderson, A., 1994. "A (100) Silicon Stress Test Chip with Optimized Piezoresistive Sensor Rosettes". In Proc. of the 1994 Electronic Components and Technology Conference (ECTC), pp. 741-749.
-
(1994)
Proc. of the 1994 Electronic Components and Technology Conference (ECTC)
, pp. 741-749
-
-
Jaeger, R.1
Suhling, J.2
Anderson, A.3
-
10
-
-
0026219178
-
Piezoresistive Stress Sensors for Structural Analysis of Electronic Packages
-
Sept.
-
Bittle, D. A., Suhling, J. C., Beaty, R. E., Jaeger, R. C., and Johnson, R. W., 1991. "Piezoresistive Stress Sensors for Structural Analysis of Electronic Packages". J. Electron. Packag., 113(3), Sept., pp. 203-215.
-
(1991)
J. Electron. Packag.
, vol.113
, Issue.3
, pp. 203-215
-
-
Bittle, D.A.1
Suhling, J.C.2
Beaty, R.E.3
Jaeger, R.C.4
Johnson, R.W.5
-
11
-
-
0028374987
-
Errors Associated with the Design, Calibration, and Application of Piezoresistive Stress Sensors in (100) Silicon
-
Jaeger, R., Suhling, J., and Ramani, R., 1994. "Errors Associated with the Design, Calibration, and Application of Piezoresistive Stress Sensors in (100) Silicon". IEEE Transactions on Components and Packaging Technology, 17(1), pp. 97-107.
-
(1994)
IEEE Transactions on Components and Packaging Technology
, vol.17
, Issue.1
, pp. 97-107
-
-
Jaeger, R.1
Suhling, J.2
Ramani, R.3
-
12
-
-
27544506409
-
Multidimensional CMOS In-Plane Stress Sensor
-
Bartholomeyczik, J., Brugger, S., Ruther, P., and Paul, O., 2005. "Multidimensional CMOS In-Plane Stress Sensor". IEEE Sensors Journal, 5(5), pp. 872-882.
-
(2005)
IEEE Sensors Journal
, vol.5
, Issue.5
, pp. 872-882
-
-
Bartholomeyczik, J.1
Brugger, S.2
Ruther, P.3
Paul, O.4
-
13
-
-
0029426583
-
Optimal Temperature Compensated Piezoresistive Stress Sensor Rosettes
-
Cordes, R., Suhling, J., Kang, Y., and Jaeger, R., 1995. "Optimal Temperature Compensated Piezoresistive Stress Sensor Rosettes". In Proc. of the Symposium on Application of Experimental Mechanics to Electronic Packaging, Vol. 13, pp. 109-116.
-
(1995)
Proc. of the Symposium on Application of Experimental Mechanics to Electronic Packaging
, vol.13
, pp. 109-116
-
-
Cordes, R.1
Suhling, J.2
Kang, Y.3
Jaeger, R.4
-
14
-
-
65949097508
-
Towards Piezoresistive CMOS Sensors for Out-of-Plane Stress
-
Lemke, B., Kratt, K., Baskaran, R., and Paul, O., 2009. "Towards Piezoresistive CMOS Sensors for Out-of-Plane Stress". In Proc. MEMS Micro Electro Mechanical Systems IEEE 22th International Conference on, pp. 781-784.
-
(2009)
Proc. MEMS Micro Electro Mechanical Systems IEEE 22th International Conference on
, pp. 781-784
-
-
Lemke, B.1
Kratt, K.2
Baskaran, R.3
Paul, O.4
-
15
-
-
0037480236
-
A Novel Stress Sensor Based on the Transverse Pseudo-Hall Effect of MOSFETs
-
Doelle, M., Ruther, P., and Paul, O., 2003. "A Novel Stress Sensor Based on the Transverse Pseudo-Hall Effect of MOSFETs". In Proc. MEMS Micro Electro Mechanical Systems IEEE 16th International Conference on, pp. 490-493.
-
(2003)
Proc. MEMS Micro Electro Mechanical Systems IEEE 16th International Conference on
, pp. 490-493
-
-
Doelle, M.1
Ruther, P.2
Paul, O.3
-
16
-
-
33846693940
-
Piezoresistance Effect in Germanium and Silicon
-
April
-
Smith, C., 1954. "Piezoresistance Effect in Germanium and Silicon". Physical Review, 94(1), April, pp. 42-49.
-
(1954)
Physical Review
, vol.94
, Issue.1
, pp. 42-49
-
-
Smith, C.1
-
17
-
-
84944484465
-
Transport properties of a many-valley semiconductor
-
March
-
Herring, C., 1955. "Transport properties of a many-valley semiconductor". Bell Syst. Tech. J., 34, March, pp. 237-290.
-
(1955)
Bell Syst. Tech. J.
, vol.34
, pp. 237-290
-
-
Herring, C.1
-
18
-
-
85008062089
-
Characterization of the Temperature Dependence of the Pressure Coefficients of n- and p-Type Silicon Using Hydrostatic Testing
-
Cho, C.-H., Jaeger, R., Suhling, J., Kang, Y., and Mian, A., 2008. "Characterization of the Temperature Dependence of the Pressure Coefficients of n- and p-Type Silicon Using Hydrostatic Testing". IEEE Sensors Journal, 8(4), pp. 392-400.
-
(2008)
IEEE Sensors Journal
, vol.8
, Issue.4
, pp. 392-400
-
-
Cho, C.-H.1
Jaeger, R.2
Suhling, J.3
Kang, Y.4
Mian, A.5
-
19
-
-
47849107906
-
Characterization of the Temperature Dependence of the Piezoresistive Coefficients of Silicon from -150°C to +125°C
-
Cho, C.-H., Jaeger, R., and Suhling, J., 2008. "Characterization of the Temperature Dependence of the Piezoresistive Coefficients of Silicon from -150°C to +125°C". IEEE Sensors Journal, 8(8), pp. 1455-1468.
-
(2008)
IEEE Sensors Journal
, vol.8
, Issue.8
, pp. 1455-1468
-
-
Cho, C.-H.1
Jaeger, R.2
Suhling, J.3
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