Piezo-FET stress-sensor arrays for wire-bonding characterization

Journal of Microelectromechanical Systems

Volumn 15, Issue 1, 2006, Pages 120-130

  Doelle, Michael ^a   Peters, Christian ^a   Ruther, Patrick ^a   Paul, Oliver ^a  

^a UNIVERSITY OF FREIBURG   (Germany)

Author keywords

Ball wedge bonding; In situ process monitoring; Piezo field transistors (FET); Stress sensor; Stress sensor array; Wire bonding

Indexed keywords

BONDING; CMOS INTEGRATED CIRCUITS; HALL EFFECT; IN SITU PROCESSING; PIEZOELECTRIC DEVICES; SEMICONDUCTOR DEVICE MANUFACTURE; SHEAR STRESS; STRESS CONCENTRATION;

BALL-WEDGE WIRE BONDING; STRESS SENSOR ARRAY; TRANSMISSION GATES;

MOSFET DEVICES;

EID: 32244433946     PISSN: 10577157     EISSN: None     Source Type: Journal    
DOI: 10.1109/JMEMS.2005.863702     Document Type: Article

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