Noncovalent mechanism for the conformal metallization of nanostructured parylene films

Langmuir

Volumn 26, Issue 6, 2010, Pages 4382-4391

  Malvadkar, Niranjan A ^a   Sekeroglu, Koray ^a   Dressick, Walter J ^b   Demirel, Melik C ^a  

^a The Center for Nanotechnology Education and Utilization   (United States)

^b NAVAL RESEARCH LABORATORY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

AFM; AMORPHOUS SURFACES; AQUEOUS SOLUTIONS; AROMATIC LIGANDS; CATALYTIC ACTIVITY; CO FILMS; ELECTROLESS METALLIZATION; FIB/SEM; LIGAND ADSORPTION; METAL DEPOSIT; METAL LAYER; METALLIZATIONS; NANO-POROUS; NANO-STRUCTURED; NANOROD ARRAYS; NON-COVALENT FUNCTIONALIZATION; NONCOVALENT; OBLIQUE ANGLES; PARYLENE FILM; PHYSISORBED; POLY(CHLORO-P-XYLYLENE); PRODUCTION OF HYDROGEN; PYRIDINE ADSORPTION; SEED LAYER; SI SUBSTRATES; SODIUM BOROHYDRIDES; TWO-LEVEL FACTORIAL DESIGN; X-RAY DIFFRACTION STUDIES;

ADSORPTION; CATALYST ACTIVITY; CHEMICALS REMOVAL (WATER TREATMENT); LIGANDS; METALLIC FILMS; METALLIZING; NANORODS; PALLADIUM; PALLADIUM COMPOUNDS; PYRIDINE; QUARTZ; SODIUM; SOLUTIONS; SUBSTRATES; VAPORS; X RAY DIFFRACTION;

COBALT;

EID: 77953770429     PISSN: 07437463     EISSN: 15205827     Source Type: Journal    
DOI: 10.1021/la9034529     Document Type: Article

References (71)

1. Lowenhaim, F.A. Modern Electroplating; John Wiley & Sons: New York, 1974.
2. Mallory, G.O., Hajdu, J.B., Eds. Electroless Plating: Fundamentals and Applications; American Electroplaters and Surface Finisher's Society: Orlando, FL 1990.
3. Gavrilov, G.G. Chemical (Electroless) Nickel-Plating; Portcullis Press: London, 1979.
4. Duffy, J.I. Electroless and Other Nonelectrolytic Plating Techniques: Recent Developments; Noyes Data Corp: Park Ridge, NJ 1980.
5. Zabetakis, D.; Dressick, W.J. ACS Appl. Mater. Interfaces 2009, 1, 4-25.
6. Cheng, K.; Yang, M.H.; Chiu, W.W. W.; Huang, C.Y.; Chang, J.; Ying, T.F.; Yang, Y. Macromol. Rapid Commun. 2005, 26, 247-264.
7. Wu, S.Y.; Kang, E.T.; Neoh, K.G.; Tan, K.L. Langmuir 2000, 16, 5192-5198.
8. Shafeev, G.A.; Themlin, J.M.; Bellard, L.; Marine, W.; Cros, A.J. Vac. Sci. Technol., A 1996, 14, 319-326.
9. Sacher, E. Prog. Surf. Sci. 1994, 47, 273-300.
10. Shachamdiamand, Y.; Dubin, V.; Angyal, M. Thin Solid Films 1995, 262, 93-103.
11. Gray, J.E.; Norton, P.R.; Griffiths, K. Thin Solid Films 2005, 484, 196-207.
12. Sipaut, C.S.; Ibrahim, M.N.M.; Izat, M.E.J. Appl. Polym. Sci. 2007, 103, 1554-1565.
13. Malvadkar, N.; Park, S.; Urquidi-MacDonald, M.; Wang, H.; Demirel, M.C.J. Power Sources 2008, 182, 323-328.
14. McCaskie, J.; Redding, S. Met. Finish 2008, 106, 25-27.
15. Zhao, Q.; Wang, C.; Liu, Y.; Wang, S. Int.J. Adhes. Adhes. 2007, 27, 85-91.
16. Mittal, K.L.J. Vac. Sci. Technol. 1976, 13, 19-25.
17. Wu, S.Y.; Kang, E.T.; Neoh, K.G.; Han, H.S.; Tan, K.L. Macromolecules 1999, 32, 186-193.
18. Bou, M.; Martin, J.M.; Lemogne, T. Appl. Surf. Sci. 1991, 47, 149-161.
19. Charbonnier, M.; Romand, M.; Esrom, H.; Seebock, R.J. Adhes. 2001, 75, 381-404.
20. Beil, S.; Horn, H.; Windisch, A.; Hilgers, C.; Pochner, K. Surf. Coat. Technol. 1999, 116, 1195-1203.
21. Weichenhain, R.; Wesner, D.A.; Pfleging, W.; Horn, H.; Kreutz, E.W. Appl. Surf. Sci. 1997, 110, 264-269.
22. Niino, H.; Yabe, A. Appl. Surf. Sci. 1993, 69, 1-6.
23. Charbonnier, M.; Romand, M.; Harry, E.; Alami, M.J. Appl. Electrochem. 2001, 31, 57-63.
24. Inagaki, N.; Tasaka, S.; Park, Y.W.J. Adhes. Sci. Technol. 1998, 12, 1105-1119.
25. Zettsu, N.; Itoh, H.; Yamamura, K. Surf. Coat. Technol. 2008, 202, 5284-5288.
26. Kang, E.T.; Zhang, Y. Adv. Mater. 2000, 12, 1481-1494.
27. Yu, W.X.; Hong, L.; Chen, B.H.; Ko, T.M.J. Mater. Chem. 2003, 13, 818-824.
28. Horn, H.; Beil, S.; Wesner, D.A.; Weichenhain, R.; Kreutz, E.W. Nucl. Instrum. Methods Phys. Res., Sect. B 1999, 151, 279-284.
29. Zaporojtchenko, V.; Zekonyte, J.; Faupel, F. Nucl. Instrum. Methods Phys. Res., Sect. B 2007, 265, 139-145.
30. Siau, S.; Vervaet, A.; Van Calster, A.; Swennen, I.; Schacht, E.J. Electrochem. Soc. 2004, 151, J54-J61.
31. Ge, J.; Turunen, M.P.K.; Kivilahti, J.K.J. Polym. Sci., Part B: Polym. Phys. 2003, 41, 623-636.
32. Vorobyova, T.N.J. Adhes. Sci. Technol. 1997, 11, 167-182.
33. Saraf, R.F.; Roldan, J.M.; Derderian, T. IBM J. Res. Dev. 1994, 38, 441-456.
34. Chung, C.K.; Fung, P.K.; Hong, Y.Z.; Ju, M.S.; Lin, C.C.K.; Wu, T.C. Sens. Actuators, B 2006, 117, 367-375.
35. Vaeth, K.M.; Jensen, K.F. Chem. Mater. 2000, 12, 1305-1313.
36. Cohen, R.L.; West, K.W.J. Electrochem. Soc. 1973, 120, 502-508.
37. Holderer, O.; Epicier, T.; Esnouf, C.; Fuchs, G.J. Phys. Chem. B 2003, 107, 1723-1726.
38. Cohen, R.L.; West, K.W.J. Electrochem. Soc. 1972, 119, 433-438.
39. Demirel, M.C.; Cetinkaya, M.; Singh, A.; Dressick, W.J. Adv. Mater. 2007, 19, 4495-4499.
40. Cetinkaya, M.; Malvadkar, N.; Demirel, M.C.J. Polym. Sci., Part B: Polym. Phys. 2008, 46, 640-648.
41. Cetinkaya, A.; Boduroglu, S.; Demirel, M.C. Polymer 2007, 48, 4130-4134.
42. Chen, M.-S.; Brandow, S.L.; Schull, T.L.; Chrisey, D.B.; Dressick, W.J. Adv. Funct. Mater. 2005, 15, 1364-1375.
43. Demirel, M.C. Colloids Surf., A 2008, 321, 121-124.
44. Dressick, W.J.; Kondracki, L.M.; Chen, M.S.; Brandow, S.L.; Matijević, E.; Calvert, J.M. Colloids Surf., A 1996, 108, 101-111.
45. Markowitz, M.; Baral, S.; Brandow, S.; Singh, A. Thin Solid Films 1993, 224, 242-247.
46. Ishida, T.; Hara, M.; Kojima, I.; Tsuneda, S.; Nishida, N.; Sasabe, H.; Knoll, W. Langmuir 1998, 14, 2092-2096.
47. Brandow, S.L.; Schull, T.L.; Martin, B.D.; Guerin, D.C.; Dressick, W.J. Chem.;Eur.J. 2002, 8, 5363-5367.
48. Dressick, W.J.; Dulcey, C.S.; Georger, J.H.; Calabrese, G.S.; Calvert, J.M.J. Electrochem. Soc. 1994, 141, 210-220.
49. Ada, E.T.; Hanley, L.; Etchin, S.; Melngailis, J.; Dressick, W.J.; Chen, M.- S.; Calvert, J.M.J. Vac. Sci. Technol., B 1995, 13, 2189-2196.
50. Yang, D.Q.; Rochette, J.F.; Sacher, E.J. Phys. Chem. B 2005, 109, 4481-4484.
51. Sauerbrey, G.Z. Angew. Phys. 1959, 155, 206-222.
52. Senkevich, J.J.; Desu, S.B. Polymer 1999, 40, 5751-5759.
53. Gao, S.; Huo, L.-H.; Shu, H.; Ng, S.W. Acta Crystallogr., Sect. E 2005, 61, m389-m391.
54. Harrowfield, J.M.; Lugan, N.; Shahverdizadeh, G.H.; Soudi, A.A.; Thuery, P. Eur.J. Inorg. Chem. 2006, 389-396.
55. Qiao, S.Z.; Bhatia, S.K.; Zhao, X.S. Microporous Mesoporous Mater. 2003, 65, 287-298.
56. Chen, M.-S.; Brandow, S.L.; Dulcey, C.S.; Dressick, W.J.; Taylor, G.N.; Bohland, J.F.; Georger, J.H.; Pavelchek, E.K.; Calvert, J.M.J. Electrochem. Soc. 1999, 146, 1421-1430.
57. Charbonnier, M.; Romand, A.; Goepfert, Y.; Leonard, D.; Bessueille, F.; Bouadi, A. Thin Solid Films 2006, 515, 1623-1633.
58. Militello, M.C.; Simko, S.J. Surf. Sci. Spectra 1994, 3, 395-401.
59. Militello, M.C.; Simko, S.J. Surf. Sci. Spectra 1994, 3, 402-409.
60. Kukula, P.; Cerveny, L. Appl. Catal., A 2002, 223, 43-55.
61. Shutthanandan, V.; Saleh, A.A.; Smith, R.J. Surf. Sci. 2000, 450, 204-226.
62. Chow, Y.M.; Lau, W.M.; Karim, Z.S. Surf. Interface Anal. 2001, 31, 321-327.
63. Sirtori, V.; Lombardi, L.; Cavallotti, P.L.; Magagnin, L. Appl. Surf. Sci. 2003, 217, 163-169.
64. Sygellou, L.; Zafeiratos, S.; Tsud, N.; Matolin, V.; Kennou, S.; Ladas, S. Surf. Interface Anal. 2002, 34, 545-549.
65. Li, L.B.; An, M.Z.; Wu, G.H. Surf. Coat. Technol. 2006, 200, 5102-5112.
66. Zafeiratos, S.; Kennou, S. Surf. Sci. 2001, 482, 266-271.
67. Brandow, S.L.; Dressick, W.J.; Marrian, C.R.K.; Chow, G.M.; Calvert, J.M.J. Electrochem. Soc. 1995, 142, 2233-2243
68. Rhee, C.K.; Kim, B.-J.; Ham, C.; Kim, Y.-J.; Song, K.; Kwon, K. Langmuir 2009, 25, 7140-7147.
69. Malvadkar, N.; Dressick, W.J.; Demirel, M.C.J. Mater. Chem. 2009, 19, 4796-4804.
70. Kao, P.; Malvadkar, N.A.; Cetinkaya, M.; Wang, H.; Allara, D.L.; Demirel, M.C. Adv. Mater. 2008, 20, 3562-3565.
71. Demirel, M.C.; Kao, P.; Malvadkar, N.; Wang, H.; Gong, X.; Poss, M.; Allara, D.L. Biointerphases 2009, 4, 35-41.