Epoxy polymer surface roughness modeling based on kinetic studies of wet chemical treatments

Journal of the Electrochemical Society

Volumn 151, Issue 8, 2004, Pages

  Siau, Sam ^a   Vervaet, Alfons ^a   Van Calster, Andre ^a   Swennen, Ives ^a   Schacht, Etienne ^a  

^a GHENT UNIVERSITY   (Belgium)

Author keywords

[No Author keywords available]

Indexed keywords

OXIDIZERS; PEEL STRENGTH; POLYMER CHAINS; WET CHEMICAL TREATMENT;

ELECTROPLATING; EPOXY RESINS; INTERFACES (MATERIALS); MATHEMATICAL MODELS; OXIDATION; RELIABILITY; SOLUTIONS;

SURFACE ROUGHNESS;

EID: 4344678043     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1766314     Document Type: Article

References (27)

1. H. Holden, Circuit World, 23(2), 14 (1997).
2. T. Swirbel, A. Naujoks, and M. Watkins, IEEE Trans. Adv. Packag., 22(3), 416 (1999).
3. J. H. Lau and S. W. R. Lee, IEEE Trans. Compon., Packag. Manuf. Technol., Part A, 25(1), 3 (2002).
4. Z. J. Yu, E. T. Kang, and K. G. Neoh, Langmuir, 18, 10221 (2002).
5. W. H. Yu, Y. Zhang, E. T. Kang, K. G. Neoh, S. Y. Wu, and Y. F. Chow, J. Electrochem. Soc., 149, C521 (2002).
6. W. C. Wang, E. T. Kang, and K. G. Neoh, Appl. Surf. Sci., 199, 52 (2002).
7. M. B. Chan-Park and S. S. Tan, Int. J. Adhes. Adhes., 22(6), 471 (2002).
8. Q. Dai, J. Zhang, and M. Ma, Appl. Surf. Sci., 72, 67 (1993).
9. D. M. Rein, L. Vaykhansky, and Y. Cohen, Polym. Adv. Technol., 13(6), 428 (2002).
10. P. S. Ho, in Principles of Electronic Packaging, D. P. Seraphim, R. Lasky, and C.-Y. Li, Editors, p. 810, McGraw-Hill Book Company, New York (1989).
11. S. Siau, A. Vervaet, E. Schacht, and A. Van Calster, J. Electrochem. Soc., 151, C133 (2004).
12. J. Ge, M. P. K. Turunen, and J. K. Kivilahti, Thin Solid Films, 440, 198 (2003).
13. W. Li and R. Tummala, in Proceedings of the 32nd International Symposium on Microelectronics, Chicago, IL, p. 348 (1999).
14. J. Ge and J. K. Kivilathi, J. Adhes. Sci. Technol., 15, 1133 (2001).
15. A. Singh and M. Mukherjee, Macromolecules, 36, 8728 (2003).
16. G. L. Gaines, Jr., and G. W. Bender, Macromolecules, 5, 82 (1972).
17. H. L. Frisch and S. Al-Madfai, J. Am. Chem. Soc., 3561, 5613 (1958).
18. J. W. Beeckman and G. F. Froment, Ind. Eng. Chem. Fundam., 18, 245 (1979).
19. J. E. Glass, J. Phys. Chem., 72, 4450 (1968).
20. C. Kittel, in Introduction to Solid State Physics, Chap. 7 and 8, John Wiley & Sons, New York (1966).
21. H. S. Carslaw and J. C. Jaeger, in Conduction of Heat in Solids, 2nd ed., Chap. 3 and 4, Oxford Science Publications, Oxford University Press, New York (1959).
22. J. S. Sharp and R. A. L. Jones, Phys. Rev. E, 66, 011801 (2002).
23. D. Schröer, R. J. Nichols, and H. Meyer, Electrochim. Acta, 40, 1487 (1995).
24. R. L. Gorring, J. Catal., 31, 13 (1973).
25. S. Jovetic, H. H. Beeftink, J. Tramper, and F. Marinelli, Enzyme Microb. Technol., 28(6), 510 (2001).
26. P. B. Weisz and C. D. Prater, Adv. Catal., 6, 143 (1954).
27. P. S. Ho, in Principles of Electronic Packaging, D. P. Seraphim, R. Lasky, and C.-Y. Li, Editors, pp. 824-829, Mc-Graw-Hill Book Company, New York (1989).