Surface properties and solderability behaviour of nickel-phosphorus and nickel-boron deposited by electroless plating

Surface and Interface Analysis

Volumn 31, Issue 4, 2001, Pages 321-327

  Chow, Y M ^a   Lau, W M ^a   Karim, Z S ^b  

^a CHINESE UNIVERSITY OF HONG KONG   (Hong Kong)

^b SHIPLEY COMPANY   (United States)

Author keywords

AFM; Electroless nickel; SAM; Solderability; Surface morphology; Surface oxide; Wetting balance; XPS

Indexed keywords

ATOMIC FORCE MICROSCOPY; ELECTROLESS PLATING; INTERFACES (MATERIALS); OXIDATION; SOLDERING; STRUCTURE (COMPOSITION); SURFACE PROPERTIES; X RAY PHOTOELECTRON SPECTROSCOPY;

SCANNING AUGER MICROSCOPY (SAM);

NICKEL;

EID: 0035305291     PISSN: 01422421     EISSN: None     Source Type: Journal    
DOI: 10.1002/sia.980     Document Type: Article

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