Investigation of cure kinetics and its effect on adhesion strength of nonconductive adhesives used in flip chip assembly

IEEE Transactions on Components and Packaging Technologies

Volumn 29, Issue 1, 2006, Pages 71-79

  Yu, Ho ^a   Mhaisalkar, S G ^a   Wong, E H ^b   Teh, L K ^a   Wong, C C ^a  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

^b INSTITUTE OF MICROELECTRONICS   (Singapore)

Author keywords

Adhesion strength; Cure kinetics; Flip chip; Gelation; Nonconductive adhesives (NCAs); Vitrification

Indexed keywords

ADHESION; ADHESIVES; CHEMICAL BONDS; CURING; DIFFERENTIAL SCANNING CALORIMETRY; GELATION; REACTION KINETICS; SEMICONDUCTOR DEVICE MANUFACTURE; SHEAR STRENGTH; VITRIFICATION;

ADHESION STRENGTH; CURE KINETICS; NONCONDUCTIVE ADHESIVES;

FLIP CHIP DEVICES;

EID: 33644789336     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2005.850524     Document Type: Article

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