Results of comparative reliability tests on lead-free solder alloys

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2002, Pages 1232-1237

  Grossmann, Günter ^a   Nicoletti, Giovanni ^a   Solèr, Ursin ^a  

^a SWISS FEDERAL LABORATORIES FOR MATERIALS SCIENCE AND TECHNOLOGY   (Switzerland)

Author keywords

[No Author keywords available]

Indexed keywords

CRACK PROPAGATION; RELIABILITY; SOLDERED JOINTS; STRAIN; TIN ALLOYS;

GRAIN BOUNDARY SLIDING (GBS);

SOLDERING ALLOYS;

EID: 0036296701     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)

1. Pb-free solders based on SnAgCu, SnAgBi SnAg and SnCu for wave soldering of Electronic Assemblies
2. The deformation behaviour of Sn62Pb36Ag2 and its implications on the design of thermal cycling tests for electronic assemblies
3. Preparation of soft solder joints