Thermal cycling reliability of heavy-gauge aluminum wires ultrasonically bonded at elevated temperature

Proceedings - 2006 International Symposium on Microelectronics, IMAPS 2006

Volumn , Issue , 2006, Pages 703-708

  Loh, Wei Sun ^a   Corfield, Martin ^a   Hogg, Simon ^b   Mark Johnson, C ^a  

^a UNIVERSITY OF SHEFFIELD   (United Kingdom)

^b UNIVERSITY OF OXFORD   (United Kingdom)

Author keywords

Grain size; Heavy gauge aluminum wire; High temperature bonding; Reliability; Thermal cycling

Indexed keywords

ALUMINUM WIRES; GRAIN SIZE; HIGH TEMPERATURE; MICRO-STRUCTURAL OBSERVATIONS; MICROSTRUCTURAL CHARACTERISATION; THERMAL CYCLING RELIABILITY; THERMAL EXPANSION COEFFICIENTS; THERMO-MECHANICAL DAMAGES;

ALUMINUM; BONDING; CRACKS; ELECTRONICS PACKAGING; GAGES; GRAIN SIZE AND SHAPE; INTERFACES (MATERIALS); MICROELECTRONICS; RELIABILITY; THERMAL CYCLING; THERMAL EXPANSION; WIRE;

FAILURE (MECHANICAL);

EID: 84876582440     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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