The deformation behavior of Sn62Pb36Ag2 and its implications on the design of thermal cycling tests for electronic assemblies

IEEE Transactions on Electronics Packaging Manufacturing

Volumn 22, Issue 1, 1999, Pages 71-79

  Grossmann, Güenter ^a  

^a SWISS FEDERAL LABORATORIES FOR MATERIALS SCIENCE AND TECHNOLOGY   (Switzerland)

Author keywords

Constitutive equation; Planning of thermal cycling tests; Reliability of solder joints

Indexed keywords

DEFORMATION; SEMICONDUCTING TIN COMPOUNDS; SOLDERED JOINTS; SURFACE MOUNT TECHNOLOGY; THERMAL CYCLING;

GRAIN BOUNDARY SLIDING (GBS);

ELECTRONICS PACKAGING;

EID: 0033319680     PISSN: 1521334X     EISSN: None     Source Type: Journal    
DOI: 10.1109/6104.755091     Document Type: Article

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