Reliability of thick Al wire bonds in IGBT modules for traction motor drives

IEEE Transactions on Advanced Packaging

Volumn 23, Issue 1, 2000, Pages 108-112

  Onuki, Jin ^a,b   Koizumi, Masahiro ^a   Suwa, Masateru ^b  

^a AKITA PREFECTURAL UNIVERSITY   (Japan)

^b HITACHI LTD   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM METALLURGY; BIPOLAR TRANSISTORS; CRACK PROPAGATION; ELECTRIC DRIVES; ELECTRIC MOTORS; ELECTRIC WIRE; FATIGUE TESTING; GRAIN BOUNDARIES; GRAIN SIZE AND SHAPE; TENSILE STRESS; THERMAL EXPANSION;

INSULATED GATE BIPOLAR TRANSISTORS (IGBT);

ELECTRONICS PACKAGING;

EID: 0033877702     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/6040.826768     Document Type: Article

References (11)

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