Accelerated thermal cycling: Is it different for lead-free solder?

Proceedings - Electronic Components and Technology Conference

Volumn 2, Issue , 2004, Pages 1579-1585

  Tunga, Krishna ^a   Kacker, Karan ^a   Pucha, Raghuram V ^a   Sitaraman, Suresh K ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DIFFUSIONAL FLOW; SLIP BANDS; TEMPERATURE RAMPS; TEST PARAMETERS;

CREEP; DATA REDUCTION; DEFORMATION; LEAD; SOLDERED JOINTS; STRESS ANALYSIS; THERMAL CYCLING; THERMAL EFFECTS;

SOLDERING ALLOYS;

EID: 10444263028     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (22)

1. th Electronic Components and Technology Conference, IEEE, San Diego, CA, pp. 538-551, 1992.
2. Darveaux, R.,"Effect of Simulation Methodology on Solder Joint Crack Growth Correlation", 50th IEEE-ECTC, pp. 1048-1058, 2000.
3. Xie, D., Arra, M., Pan, H., Shangguan, D., Geiger, D., Yi, S., "Life Prediction of Lead Free Solder Joints for Handheld Products", Proc of 2002 IMAP/SMTA conference, 2002.
4. Dowling, N. E., "Mechanical Behavior of Materials", Prentice Hall, 1993.
5. Engelmaier, W., "The Use Environments of Electronic Assemblies and Their Impact on Surface Mount Solder Attachment Reliability," IEEE Trans. on Components, Packaging, and Manufacturing Technology, vol. 13, no. 4, pp 903-908, 1990.
6. rd Electronic Components and Technology Conf. 2002, pp. 1232-1237.
7. Hellemans, R., and Lewandowski, P., "Low Cost Electronics Packaging for the Severe Automotive Environment"., Electronic Packaging Forum Multichip Module Technology Issues., Edited by Morris, J. E., IEEE Press, 1993.
8. Interconnection Technology Research Institute 1998, Ball Grid Array Packaging Guidelines, Jet Propulsion Laboratory, California Inst. Tech.
9. Jurgen, R., "Automotive Electonics Handbook", McGraw Hill Publication, 1995.
10. Meilunas, M., Primavera, A., Steven, O., Dunford., "Reliability and Failure Analysis of Lead-Free Solder Joints" Proc. IPC Annual Conference, New Orleans, 2001.
11. Mirman, B., "Impact of low temperatures on solder joint failures," ASME J. Electron. Packag., 124(2), June, pp. 135-137, 2002
12. Pfahl., R, "Pb-Free Electronics: Drivers, R&D and Transition", NEMI, Supply Network Conference, September 18, 2003, San Jose, CA.
13. Pucha, R. V., Pyland, J., and Sitaraman, S. K., "Damage Metric-Based Mapping Approaches for Developing Accelerated Thermal Cycling Guidelines for Electronic Packages," International Journal of Damage Mechanics, Vol. 10, July, pp. 214-234, 2001.
14. Pyland, J., Pucha R. V., Sitaraman S. K., "Thermo-mechanical reliability of underfilled BGA packages". IEEE Transactions on Electronics Packaging Manufacturing, Vol. 25, No. 2, pp. 100-106, 2002.
15. Roubaud, P., Henshall, G., Bulwith, R., Prasad, S., Carson, F., Kamath, S., O'Keeffe, E., "Thermal Fatigue Resistance of Pb-Free Second Level Interconnect", Proc of 2001 SMTA International Conferences, 2001.
16. Schubert, R., Dudek, R., Doring, H., Walter, E., Auerswald, A., Goll hardt, B., Schuch, H., Sitzmann, B., Michel., "Lead-free Solder Interconnects: Charaterization, Testing and Reliability" Proc. Of EuroSIME 2002, pp. 62-72.
17. th Electronic Components and Technology Conf, 1999, pp.111-117.
18. SM, 2001.
19. SRC/CINDAS Microelectronics Packaging Materials Database, Sept. 1995 release.
20. Tunga, K., Pyland, J., Pucha, R. V., Sitaraman, S. K., "Study on the choice of constitutive and fatigue models in solder joint life prediction" Proc. Of IMECE 2002 ASME International Mechanical Engineering Congress and Expositon, New Orleans, Lousiana, 2002.
21. Tunga, K., "Experimental and theoretical assessment of PBGA reliability in conjuction with field-use conditions", MS Thesis, School of Mechanical Engineeing, Georgia Institue of Technology, Atlanta, 2004.
22. th Electronic Components and Technology Conf, 2003, pp. 197-206.