An investigation of electromigration induced void nucleation time statistics in short copper interconnects

Journal of Applied Physics

Volumn 107, Issue 10, 2010, Pages

  Dwyer, V M ^a  

^a LOUGHBOROUGH UNIVERSITY   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER INTERCONNECTS; DIFFUSION ACTIVATION ENERGY; FINITE ELEMENT CALCULATIONS; GRAIN SIZE; GRAIN SIZE DISTRIBUTION; LINE PARAMETERS; LOG-NORMAL; MASS-LUMPING; MESH POINTS; MESH SIZE; NON-LINEARITY; SEM; SIMULATION RESULT; SIMULATION TIME; SOLUTION METHODS; STANDARD METHOD; STATIC TIMING ANALYSIS; STRESS EVOLUTION; TIME CONSTANTS; TIME DISTRIBUTION; VERY LARGE SCALE INTEGRATED; VOID DYNAMICS; VOID NUCLEATION; VOLTAGE DEVELOPMENT;

ACTIVATION ENERGY; COMPUTER SIMULATION; FINITE ELEMENT METHOD; GRAIN SIZE AND SHAPE; NUCLEATION; STANDARDIZATION;

NORMAL DISTRIBUTION;

EID: 77952984194     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.3309744     Document Type: Article

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