The influence of microstructure on the probability of early failure in aluminum-based interconnects

Journal of Applied Physics

Volumn 96, Issue 5, 2004, Pages 2914-2922

  Dwyer, V M ^a  

^a LOUGHBOROUGH UNIVERSITY   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM; CONVERGENCE OF NUMERICAL METHODS; DIFFUSION; GRAIN BOUNDARIES; GRAIN GROWTH; MATHEMATICAL MODELS; MICROSTRUCTURE; NORMAL DISTRIBUTION; NUCLEATION; TUNGSTEN;

GRAIN SIZE DISTRIBUTIONS; MATERIAL PROPERTIES; POLYGRANULAR SEGMENTS; STANDARD DEVIATION;

ELECTROMIGRATION;

EID: 4944255802     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.1771825     Document Type: Article

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