Via-depletion electromigration in copper interconnects

IEEE Transactions on Device and Materials Reliability

Volumn 6, Issue 2, 2006, Pages 163-168

  Christiansen, Cathryn J ^a   Li, Baozhen ^a   Gill, Jason ^a   Filippi, Ronald ^a   Angyal, Matthew ^a  

^a IBM   (United States)

Author keywords

Cu interconnect; Electromigration; Liner; Redundancy; Reliability; Via; Void

Indexed keywords

ELECTROMIGRATION; OPTIMIZATION; REDUNDANCY; RELIABILITY; SEMICONDUCTOR MATERIALS;

CU INTERCONNECT; LINER; VIA; VOID;

COPPER;

EID: 33748094438     PISSN: 15304388     EISSN: 15304388     Source Type: Journal    
DOI: 10.1109/TDMR.2006.876595     Document Type: Conference Paper

References (7)

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