Simulation of the temperature and current density scaling of the electromigration-limited reliability of near-bamboo interconnects

Journal of Materials Research

Volumn 13, Issue 5, 1998, Pages 1164-1170

  Knowlton, B D ^a   Thompson, C V ^a  

^a MASSACHUSETTS INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0004645284     PISSN: 08842914     EISSN: None     Source Type: Journal    
DOI: 10.1557/JMR.1998.0166     Document Type: Article

References (33)

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