Femtosecond laser micromachining and application of hot embossing molds for microfluid device fabrication

Journal of Laser Applications

Volumn 21, Issue 4, 2009, Pages 196-204

  Choi, Hae Woon ^a   Bong, Seon ^a   Farson, Dave F ^b   Lu, Chunmeng ^c   Lee, L James ^c  

^a Keimyung University   (South Korea)

^b OHIO STATE UNIVERSITY   (United States)

^c Ohio State University   (United States)

Author keywords

Femtosecond laser micromachining; Hot embossing mold; Microfluidic channel

Indexed keywords

ABLATION EFFICIENCY; ABLATION THRESHOLDS; AISI 304L STAINLESS STEEL; CHANNEL PATTERN; DEVICE FABRICATIONS; FEMTOSECOND LASER MICROMACHINING; FLUID CHANNELS; HOT EMBOSSING MOLD; HOT-EMBOSSING; MACHINING PROCESS; MAXIMUM VALUES; MICRO-FLUID; MICROFLUIDIC CHANNEL; MOLD PATTERN; PULSE ENERGIES; SINGLE PULSE;

ABLATION; COMPOSITE MICROMECHANICS; FLUIDIC DEVICES; LITHOGRAPHY; MICROFLUIDICS; MICROMACHINING; MOLDS; PULSED LASER APPLICATIONS; STAINLESS STEEL;

ULTRASHORT PULSES;

EID: 77952916166     PISSN: 1042346X     EISSN: None     Source Type: Journal    
DOI: 10.2351/1.3263118     Document Type: Article

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