MEMS/microfluidics packaging without heating

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 7592, Issue , 2010, Pages

  Howlader, Matiar R ^a  

^a MCMASTER UNIVERSITY   (Canada)

Author keywords

Bonding strength; Electron energy loss spectroscopy; Nanointerface; Nanopores; Sequential plasma activated bonding; Surface roughness; Void and viscous flow; Water contact angle

Indexed keywords

BONDING STRENGTH; NANO-INTERFACE; PLASMA-ACTIVATED BONDINGS; SEQUENTIAL PLASMA ACTIVATED BONDING; WATER CONTACT ANGLE;

AMORPHOUS SILICON; ANNEALING; CONTACT ANGLE; COVALENT BONDS; DEFECTS; DESORPTION; DIFFUSION BONDING; DISSOCIATION; ELECTRON EMISSION; ELECTRON ENERGY LEVELS; ELECTRON SCATTERING; ENERGY DISSIPATION; NANOPORES; NANOSTRUCTURED MATERIALS; NUCLEAR INSTRUMENTATION; OXYGEN; PACKAGING; PLASMAS; REACTIVE ION ETCHING; SILICON COMPOUNDS; SILICON OXIDES; SURFACE PROPERTIES; SURFACE ROUGHNESS; VISCOSITY; VISCOUS FLOW; WATER ABSORPTION;

ELECTRON ENERGY LOSS SPECTROSCOPY;

EID: 77951570880     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.845291     Document Type: Conference Paper

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