-
2
-
-
84974183414
-
A method for interpreting the data depth-sensing indentation instruments
-
Doerner, M. F.; Nix, W. D. A method for interpreting the data depth-sensing indentation instruments. J. Mater. Res., 1986, 1(4), 601-609.
-
(1986)
J. Mater. Res.
, vol.1
, Issue.4
, pp. 601-609
-
-
Doerner, M.F.1
Nix, W.D.2
-
3
-
-
33751280237
-
Substrate influence in Young's modulus determination of thin films by indentation methods: Cubic boron nitride as an example
-
Richter, F.; Herrmann, M.; Molnar, F.; Chudoba, T.; Schwarzer, N.; Keunecke, M.; Bewilogua, K.; Zhang, X. W.; Boyen, H. -G.; Zieman, P. Substrate influence in Young's modulus determination of thin films by indentation methods: Cubic boron nitride as an example. Surf. Coat. Technol., 2006, 201(6), 3577-3587.
-
(2006)
Surf. Coat. Technol.
, vol.201
, Issue.6
, pp. 3577-3587
-
-
Richter, F.1
Herrmann, M.2
Molnar, F.3
Chudoba, T.4
Schwarzer, N.5
Keunecke, M.6
Bewilogua, K.7
Zhang, X.W.8
Boyen, H.G.9
Zieman, P.10
-
4
-
-
33947510992
-
Nanoindentation characteristics of clamped freestanding Cu membranes
-
Wang, T. H.; Fang, T. H.; Kang, S. H.; Lin, Y. C. Nanoindentation characteristics of clamped freestanding Cu membranes. Nanotechnology, 2007, 18(13), 135701.
-
(2007)
Nanotechnology
, vol.18
, Issue.13
, pp. 135701
-
-
Wang, T.H.1
Fang, T.H.2
Kang, S.H.3
Lin, Y.C.4
-
5
-
-
33846123305
-
A numerical study of factors affecting the characterization of nanoindentation on silicon
-
Wang, T. H.; Fang, T. H.; Lin, Y. C. A numerical study of factors affecting the characterization of nanoindentation on silicon. Mater. Sci. Eng. A, 2007, 447(1-2), 244-253.
-
(2007)
Mater. Sci. Eng. A
, vol.447
, Issue.1-2
, pp. 244-253
-
-
Wang, T.H.1
Fang, T.H.2
Lin, Y.C.3
-
6
-
-
33846173920
-
Analysis of the substrate effects of strain-hardening thin films on silicon under nanoindentation
-
Wang, T. H.; Fang, T. H.; Lin, Y. C. Analysis of the substrate effects of strain-hardening thin films on silicon under nanoindentation. Appl. Phys. A, 2007, 86, 335-341.
-
(2007)
Appl. Phys. A
, vol.86
, pp. 335-341
-
-
Wang, T.H.1
Fang, T.H.2
Lin, Y.C.3
-
7
-
-
1342344862
-
Finite element analysis of substrate effects on indentation behaviour of thin films
-
Xu, Z. H.; Rowcliffe, D. Finite element analysis of substrate effects on indentation behaviour of thin films. Thin Solid Films, 2004, 447, 399-405.
-
(2004)
Thin Solid Films
, vol.447
, pp. 399-405
-
-
Xu, Z.H.1
Rowcliffe, D.2
-
8
-
-
0032306727
-
The importance of contact radius for substrate-independent property measurement of thin films
-
Hay, J. L.; O'Hern, M. E.; Oliver, W. C. The importance of contact radius for substrate-independent property measurement of thin films. Mater. Res. Soc. Symp. Proc., 1998, 522, 27-32.
-
(1998)
Mater. Res. Soc. Symp. Proc.
, vol.522
, pp. 27-32
-
-
Hay, J.L.1
O'Hern, M.E.2
Oliver, W.C.3
-
9
-
-
0032026416
-
Tension-tension fatigue of copper thin films
-
Read, D. T. Tension-tension fatigue of copper thin films. Int. J. Fatigue, 1998, 20, 203-209.
-
(1998)
Int. J. Fatigue
, vol.20
, pp. 203-209
-
-
Read, D.T.1
-
10
-
-
0037425467
-
Size effects in the fatigue behavior of thin Ag films
-
Schwaiger, R.; Kraft, O. Size effects in the fatigue behavior of thin Ag films. Acta Mater., 2003, 51, 195-206.
-
(2003)
Acta Mater.
, vol.51
, pp. 195-206
-
-
Schwaiger, R.1
Kraft, O.2
-
11
-
-
0028391872
-
A theory of fatigue crack initiation
-
Mura, T. A theory of fatigue crack initiation. Mater. Sci. Eng. A, 1994, 176, 61-70.
-
(1994)
Mater. Sci. Eng. A
, vol.176
, pp. 61-70
-
-
Mura, T.1
-
12
-
-
33645903815
-
Microvoid nucleation at the interface between a thin film and a substrate in fatigue
-
Qin, S.; Fan, H.; Mura, T. Microvoid nucleation at the interface between a thin film and a substrate in fatigue. J. Appl. Phys., 1991, 70(3), 1405-1411.
-
(1991)
J. Appl. Phys.
, vol.70
, Issue.3
, pp. 1405-1411
-
-
Qin, S.1
Fan, H.2
Mura, T.3
-
13
-
-
0022696917
-
The supermodulus effect in compositionally modulated thin films
-
Cammarata, R.C. The supermodulus effect in compositionally modulated thin films. Scr. Metall., 1986, 20(4), 479-486.
-
(1986)
Scr. Metall.
, vol.20
, Issue.4
, pp. 479-486
-
-
Cammarata, R.C.1
-
14
-
-
0942290077
-
Coherent growth and mechanical properties of AlN/VN multilayers
-
Li, G. Y.; Lao, J. J.; Tian, J. W.; Han, Z. H.; Gu, M. Y. Coherent growth and mechanical properties of AlN/VN multilayers. J. Appl. Phys., 2004, 95(1), 92-96.
-
(2004)
J. Appl. Phys.
, vol.95
, Issue.1
, pp. 92-96
-
-
Li, G.Y.1
Lao, J.J.2
Tian, J.W.3
Han, Z.H.4
Gu, M.Y.5
-
15
-
-
0035972906
-
Improvement of mechanical properties of Ti/TiN multilayer film deposited by sputtering
-
Mori, T.; Fukuda, S.; Takemura, Y. Improvement of mechanical properties of Ti/TiN multilayer film deposited by sputtering. Surf. Coat. Technol., 2001, 140, 122-127.
-
(2001)
Surf. Coat. Technol.
, vol.140
, pp. 122-127
-
-
Mori, T.1
Fukuda, S.2
Takemura, Y.3
-
16
-
-
33646153989
-
The formation of γ-TiAl from Ti/Al multilayers with different periods
-
Ramos, A. S.; Calinas, R.; Vieira, M. T. The formation of γ-TiAl from Ti/Al multilayers with different periods. Surf. Coat. Technol., 2006, 200, 6196-6200.
-
(2006)
Surf. Coat. Technol.
, vol.200
, pp. 6196-6200
-
-
Ramos, A.S.1
Calinas, R.2
Vieira, M.T.3
-
17
-
-
33746715571
-
Nanometric multilayers: A new approach for joining TiAl
-
Ramos, A. S.; Vieira, M. T.; Duarte, L. I.; Vieira, M. F.; Vianna, F.; Calinas, R. Nanometric multilayers: A new approach for joining TiAl. Intermetallics, 2006, 14, 1157-1162.
-
(2006)
Intermetallics
, vol.14
, pp. 1157-1162
-
-
Ramos, A.S.1
Vieira, M.T.2
Duarte, L.I.3
Vieira, M.F.4
Vianna, F.5
Calinas, R.6
-
18
-
-
0026875935
-
An improved technique for determining hardness and elastic-modulus using load and displacement sensing indentation experiments
-
Oliver, W. C.; Pharr, G. M. An improved technique for determining hardness and elastic-modulus using load and displacement sensing indentation experiments. J. Mater. Res., 1992, 7(6), 1564
-
(1992)
J. Mater. Res.
, vol.7
, Issue.6
, pp. 1564
-
-
Oliver, W.C.1
Pharr, G.M.2
-
19
-
-
0023533637
-
Elastic analysis of some punch problems for a layered medium
-
King, R. B. Elastic analysis of some punch problems for a layered medium. Int. J. Solids Struct., 1987, 23, 1657-1664.
-
(1987)
Int. J. Solids Struct.
, vol.23
, pp. 1657-1664
-
-
King, R.B.1
-
21
-
-
0036810331
-
Texture enhancement of Al films on Ti underlayers by radio-frequency bias sputtering
-
Park, D. S.; Kim, Y. H. Texture enhancement of Al films on Ti underlayers by radio-frequency bias sputtering. J. Electron. Mater., 2002, 31, 1009-1015.
-
(2002)
J. Electron. Mater.
, vol.31
, pp. 1009-1015
-
-
Park, D.S.1
Kim, Y.H.2
-
22
-
-
33845945316
-
The deformation and ageing of mild steel: III discussion of re- Sults
-
Hall, E. O. The deformation and ageing of mild steel: III discussion of re- sults. Proc. Phys. Soc., 1951, 64, 747-753.
-
(1951)
Proc. Phys. Soc.
, vol.64
, pp. 747-753
-
-
Hall, E.O.1
-
23
-
-
0002228943
-
The cleavage strength of polycrystals
-
Petch, N. J. The cleavage strength of polycrystals. J. Iron Steel Inst., 1953, 174, 25-28.
-
(1953)
J. Iron Steel Inst.
, vol.174
, pp. 25-28
-
-
Petch, N.J.1
-
24
-
-
11944275568
-
Grain growth in thin film
-
Thompsom, C. V. Grain growth in thin film. Ann. Rev. Mater. Sci., 1990, 20, 245-268.
-
(1990)
Ann. Rev. Mater. Sci.
, vol.20
, pp. 245-268
-
-
Thompsom, C.V.1
-
25
-
-
0043192617
-
A maximum in the strength of nanocrystalline copper
-
Schiotz, J.; Jacobsen, K. W. A maximum in the strength of nanocrystalline copper. Science, 2003, 301, 1357-1359.
-
(2003)
Science
, vol.301
, pp. 1357-1359
-
-
Schiotz, J.1
Jacobsen, K.W.2
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