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Applied Physics A: Materials Science and Processing

Volumn 86, Issue 3, 2007, Pages 335-341

Analysis of the substrate effects of strain-hardening thin films on silicon under nanoindentation

(3) Wang, T H a,b Fang, T H c Lin, Y C a

a NATIONAL CHENG KUNG UNIVERSITY (Taiwan)

b ADVANCED SEMICONDUCTOR ENGINEERING INC (Taiwan)

c NATIONAL FORMOSA UNIVERSITY (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ELASTIC MODULI; FINITE ELEMENT METHOD; INDENTATION; NANOTECHNOLOGY; SILICON; STRAIN HARDENING; SUBSTRATES;

MISMATCH SUBSTRATES; NANOINDENTATION; SILICON SUBSTRATES; SOFT FILMS;

THIN FILMS;

EID: 33846173920 PISSN: 09478396 EISSN: 14320630 Source Type: Journal
DOI: 10.1007/s00339-006-3779-6 Document Type: Article

Times cited : (22)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.