Nanoindentation characteristics of clamped freestanding Cu membranes

Nanotechnology

Volumn 18, Issue 13, 2007, Pages

  Wang, Tong Hong ^a,b   Fang, Te Hua ^c   Kang, Shao Hui ^d   Lin, Yu Cheng ^a  

^a NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

^b ADVANCED SEMICONDUCTOR ENGINEERING INC   (Taiwan)

^c NATIONAL FORMOSA UNIVERSITY   (Taiwan)

^d SOUTHERN TAIWAN UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; ELASTIC CONSTANTS; FINITE ELEMENT METHOD; NANOINDENTATION; PLASTIC DEFORMATION;

COPPER MEMBRANE; ELASTIC RECOVERY; LOAD DEFLECTION CURVE; STRETCHING INDUCED DEFORMATION;

MEMBRANES;

CUPROPHANE;

ARTICLE; FILM; FINITE ELEMENT ANALYSIS; MEMBRANE; OBSERVATIONAL STUDY; PRIORITY JOURNAL; STRETCHING; YOUNG MODULUS;

EID: 33947510992     PISSN: 09574484     EISSN: 13616528     Source Type: Journal    
DOI: 10.1088/0957-4484/18/13/135701     Document Type: Article

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