A numerical study of factors affecting the characterization of nanoindentation on silicon

Materials Science and Engineering: A

Volumn 447, Issue 1-2, 2007, Pages 244-253

  Wang, Tong Hong ^a,c   Fang, Te Hua ^b   Lin, Yu Cheng ^a  

^a NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

^b NATIONAL FORMOSA UNIVERSITY   (Taiwan)

^c ADVANCED SEMICONDUCTOR ENGINEERING INC   (Taiwan)

Author keywords

Contact mechanics; Finite element method; Nanoindentation; Nanotribology

Indexed keywords

CHARACTERIZATION; ELASTIC MODULI; FINITE ELEMENT METHOD; FRICTION; HARDNESS; INDENTATION; STRESS CONCENTRATION; TRIBOLOGY;

CONTACT MECHANICS; NANOINDENTATION; NANOTRIBOLOGY;

SILICON;

CHARACTERIZATION; ELASTIC MODULI; FINITE ELEMENT METHOD; FRICTION; HARDNESS; INDENTATION; SILICON; STRESS CONCENTRATION; TRIBOLOGY;

EID: 33846123305     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2006.10.077     Document Type: Article

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