Low-cost, high-volume packaging techniques for silicon sensors and actuators.

Volumn , Issue , 1988, Pages 123-124

  Mallon, Joseph ^a   Bryzek, Janusz ^a   Ramsey, Jeff ^a   Tomblin, Graham ^a   Pourahmadi, Farzad ^a  

^a Lucas NovaSensor   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ACTUATORS -- ELECTRONICS PACKAGING; ELECTRONICS PACKAGING -- DESIGN; SEMICONDUCTING SILICON;

CONFIGURABILITY; HIGH-VOLUME PACKAGING; LOW-COST PACKAGING;

SENSORS;

EID: 0024143717     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (0)