Microsensors vs. integrated circuits: A study in contrasts

Technical Digest - International Electron Devices Meeting

Volumn , Issue , 1989, Pages 3-7

  Senturia, Stephen D ^a  

^a MASSACHUSETTS INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; SENSORS;

MICROSENSORS; PACKAGING CONSTRAINTS; STRESS DISTRIBUTIONS; SYSTEM PARTITIONING;

INTEGRATED CIRCUITS;

EID: 0024918268     PISSN: 01631918     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (37)