Failure mechanisms of dummy IGBT assembles constructed using liquid In-Sn/Nb system

Proceedings of the Electronic Packaging Technology Conference, EPTC

Volumn , Issue , 2007, Pages 43-46

  Li, Jianfeng ^a   Sarvar, Farhad ^b   Whalley, David C ^b   Hutt, David A ^b   Clode, Mike P ^a   Mannan, Samjid H ^a  

^a KING'S COLLEGE LONDON   (United Kingdom)

^b LOUGHBOROUGH UNIVERSITY   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

ACTIVE FILTERS; BIPOLAR TRANSISTORS; BRAZING; CHIP SCALE PACKAGES; ELECTRONICS PACKAGING; FAILURE ANALYSIS; HIGH TEMPERATURE OPERATIONS; INSULATED GATE BIPOLAR TRANSISTORS (IGBT); MELTING POINT; NIOBIUM; PAINTING; QUALITY ASSURANCE; RELIABILITY; SILICONES; STRESSES; TECHNOLOGY; THERMOCHEMISTRY; TIN; WELDING; WIRE;

BARRIER LAYER; BOND PADS; CONNECTING WIRES; ELEVATED TEMPERATURES; FAILURE MECHANISMS; GLOB-TOP; HIGH TEMPERATURE; INSULATED-GATE; JOINT FAILURES; LIQUID SOLDERS; LOW MELTING POINT; MECHANICAL TESTING; PACKAGING TECHNOLOGIES; SOLDER JOINTS; UNDERFILL;

ELECTRONIC EQUIPMENT MANUFACTURE;

EID: 50049120791     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2007.4469799     Document Type: Conference Paper

References (13)

1. Keelere, R., "Liquid Interconnects for Fine Pitch Assembly?", EP&P, Vol. 29, No. 6 (1989), pp. 14-18.
2. Ellerson J. V., Funari, J., Varcoe, J. A., "Interconnection of a Carrier Substrate and a Semiconductor Device", U.S. Patent 5553769, 1996. (Similarly 5, 920, 125).
3. T.P. Dolbear, C.A. MacKay, and R.D. Nelson, "Liquid Metal Paste for Thermal and Electrical Connections", U.S. Patent 5170930, 1992.
4. J.W. Smith, "Microelectronic Connections with Liquid Conductive Elements", U.S. Patent 5808874, 1998. (Similarly 6, 202, 298, 6, 437, 240).
5. Nowottnick, M., Pape, U., Wittke K., Steel, W., "Solder Joints for High Temperature Electronics", 2003 SMTA International Conference Proceedings, Chicago, IL, USA, September 21-25, 2003, pp. 693-699.
6. Mannan S. H., Clode, M. P., "Materials and Processes for Implementing High Temperature Liquid Interconnects", IEEE Trans. on Adv. Packaging, Vol. 27, No. 3 (2004), pp. 508-514.
7. Mannan S. H., Clode, M. P., Dagher, M., "Study of Intermetallic Crystal Growth between Nb and Molten 52In-48Sn Solder", J Electron Mater, Vol. 34, No.2 (2005) pp.125-131.
8. Li J. F., Mannan S. H., Clode, M. P., Johnston, C., Crossley, A., "Dissolution and Interfacial reaction of Nb in Contact with the Molten 52In-48Sn Solder", In Press Acta Mater (2007), doi:10.1016/j. actamat.2007.05.026
9. Chung, S., Tang, Z., Park, S., "Effects of Phase Change of Pb-free Flip-Chip Solders During Board-Level Interconnect Reflow", IEEE Trans. Adv. Pack,. Vol. 30, No.1 (2007), pp. 38-43.
10. Li J. F., Mannan S. H., Clode, M. P., Whalley, D. C., Hutt, D. A., Interfacial reactions between molten Sn-Bi-X solders and Cu substrates for liquid solder interconnects, Acta Materialia, Vol. 54, No.11 (2006) pp. 2907-2922.
11. Li J. F., Mannan S. H., Clode, M. P., Whalley, D. C., Liu, C., Hutt, D. A., Comparison of interfacial reactions of Ni and Ni-P in extended contact with liquid Sn-Bi-based solders, J.F. Li, S.H. Mannan, M.P. Clode, K. Chen, D.C. Whalley, C. Liu and D.A. Hutt, Acta Materialia, Vol. 55, No.2 (2007) pp. 737-752.
12. Li J. F., Mannan S. H., Clode, M. P., Lobato, H., Liu, C. Q., Whalley, D. C., Hutt, D. A., Conway, P. P., Interfacial Reaction Between Molten Sn-Bi Based Solders and Ni-P Substrate for Liquid Solder Interconnects, Accepted IEEE Transactions on Components and Packaging Technologies, 2007.
13. Chen, K., Liu, C., Whalley, D. C., Hutt, D. A., Li, J. F. and Mannan, S.H., Electroless Ni-W-P Alloys as Barrier Coatings for Liquid Solder Interconnects, Proceedings of the 1st IEEE Electronic System integration Technology Conference, Dresden, Sept 5-7, 2006, Volume 1, pp 421-427, ISBN: 1-4244-0553-X.