Reliability and failure analysis of dummy IGBT assembles using liquid solder joints under thermal cycling

Proceedings - 2006 IMAPS International Conference and Exhibition on High Temperature Electronics, HiTEC 2006

Volumn , Issue , 2006, Pages 390-397

  Li, Jianfeng ^a   Mannan, Samjid H ^a   Clode, Mike P ^a   Fenner, David N ^a   Whalley, David C ^b   Chen, Keming ^b  

^a KING'S COLLEGE LONDON   (United Kingdom)

^b LOUGHBOROUGH UNIVERSITY   (United Kingdom)

Author keywords

High temperature electronics; IGBT; Liquid solder joints; Reliability; Stress; Thermal cycling

Indexed keywords

ALUMINA SUBSTRATES; ELECTRICALLY CONDUCTIVE; ELEVATED TEMPERATURE; HIGH-TEMPERATURE ELECTRONICS; LIQUID SOLDERS; LOW MELTING POINT SOLDER; MECHANICAL INTEGRITY; MICROSTRUCTURAL FEATURES;

ALUMINA; INDIUM; INSULATED GATE BIPOLAR TRANSISTORS (IGBT); INTERFACE STATES; LIQUIDS; MICROSTRUCTURAL EVOLUTION; RELIABILITY; STRESSES; THERMAL CYCLING; TIN;

FAILURE ANALYSIS;

EID: 77950919813     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)

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