From 3D circuit technologies and data structures to interconnect prediction

International Workshop on System Level Interconnect Prediction, SLIP

Volumn , Issue , 2009, Pages 77-84

  Fischbach, Robert ^a   Lienig, Jens ^a   Meister, Tilo ^a  

^a DRESDEN UNIVERSITY OF TECHNOLOGY   (Germany)

Author keywords

3D floorplanning; 3D integration; Data structures; Interconnect prediction; Three dimensional circuits

Indexed keywords

3-D INTEGRATED CIRCUIT; 3-D INTEGRATION; 3-D PACKAGES; 3D CIRCUIT; 3D DATA; 3D TECHNOLOGY; FLOOR-PLANNING; HETEROGENEOUS SYSTEMS; INTEGRATION DENSITY; INTERCONNECT PREDICTION; LAYOUT DESIGNERS; MOORE'S LAW; NEW TECHNOLOGIES; RAPID DEVELOPMENT; THREE-DIMENSIONAL CIRCUITS;

DATA STRUCTURES; ELECTRIC POWER SYSTEM INTERCONNECTION; FORECASTING; INFRARED DETECTORS; INTEGRATED CIRCUITS; INTEGRATION; TECHNICAL PRESENTATIONS; TECHNOLOGY;

THREE DIMENSIONAL;

EID: 77950825018     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1145/1572471.1572485     Document Type: Conference Paper

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