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Volumn E83-A, Issue 4, 2000, Pages 639-645

The 3D-packing by meta data structure and packing heuristics

Author keywords

3D packing; Placement; Sequence pair; Sequence triple; Simulated annealing

Indexed keywords

PACKING HEURISTICS; THREE-DIMENSIONAL PACKING PROBLEMS;

EID: 0033725877     PISSN: 09168508     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article
Times cited : (76)

References (7)
  • 2
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    • VLSI module placement based on rectangle-packing by the sequence-pair
    • Dec.
    • H. Murata, K. Fujiyoshi, S. Nakatake, and Y. Kajitani, "VLSI module placement based on rectangle-packing by the sequence-pair," IEEE Trans. on CAD, vol.15, no12, pp.1518-1524, Dec. 1996.
    • (1996) IEEE Trans. on CAD , vol.15 , Issue.12 , pp. 1518-1524
    • Murata, H.1    Fujiyoshi, K.2    Nakatake, S.3    Kajitani, Y.4
  • 3
    • 0025505076 scopus 로고
    • On three-dimensional packing
    • Oct.
    • K. Li and K.H. Cheng, "On three-dimensional packing," SIAM J. Computing, vol.19, no5, pp.847-867, Oct. 1990
    • (1990) SIAM J. Computing , vol.19 , Issue.5 , pp. 847-867
    • Li, K.1    Cheng, K.H.2
  • 4
    • 38249009313 scopus 로고
    • Heuristic algorithms for on-line packing in three dimensions
    • Dec.
    • K. Li and K.H. Cheng, "Heuristic algorithms for on-line packing in three dimensions," J. Algorithms, vol.13, no4, pp.589-605, Dec. 1992
    • (1992) J. Algorithms , vol.13 , Issue.4 , pp. 589-605
    • Li, K.1    Cheng, K.H.2
  • 5
    • 0001360171 scopus 로고    scopus 로고
    • An algorithm for the three-dimensional packing problem with asymptotic performance analysis
    • May
    • F.K. Miyazawa and Y. Wakabayashi, "An algorithm for the three-dimensional packing problem with asymptotic performance analysis," Algorithmica, vol.18, nol, pp.122-144, May 1997.
    • (1997) Algorithmica , vol.18 , Issue.50 , pp. 122-144
    • Miyazawa, F.K.1    Wakabayashi, Y.2
  • 6
    • 0030408582 scopus 로고    scopus 로고
    • Module placement on BSG-structure and IC layout applications
    • Nov.
    • S. Nakatake, K. Fujiyoshi, H. Murata, and Y. Kajitani, "Module placement on BSG-structure and IC layout applications," Proc. of ICCAD '96, pp.484-491, Nov. 1996.
    • (1996) Proc. of ICCAD '96 , pp. 484-491
    • Nakatake, S.1    Fujiyoshi, K.2    Murata, H.3    Kajitani, Y.4
  • 7
    • 0032090672 scopus 로고    scopus 로고
    • Module packing based on the BSG-structure and IC layout applications
    • June
    • S. Nakatake, H. Murata, K. Fujiyoshi, and Y. Kajitani, "Module packing based on the BSG-structure and IC layout applications," IEEE Trans, on CAD, vol.17, no6, pp.519-530, June 1998.
    • (1998) IEEE Trans, on CAD , vol.17 , Issue.6 , pp. 519-530
    • Nakatake, S.1    Murata, H.2    Fujiyoshi, K.3    Kajitani, Y.4


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.