Fabrication of thin SU-8 cantilevers: Initial bending, release and time stability

Journal of Micromechanics and Microengineering

Volumn 20, Issue 4, 2010, Pages

  Keller, Stephan ^a   Haefliger, Daniel ^b   Boisen, Anja ^a  

^a TECHNICAL UNIVERSITY OF DENMARK   (Denmark)

^b Sensirion AG   (Switzerland)

Author keywords

[No Author keywords available]

Indexed keywords

AMBIENT TEMPERATURES; CANTILEVER BENDING; COATED SUBSTRATES; HARD BAKE; INITIAL BENDING; OPTIMIZED PROCESS; POSTEXPOSURE BAKE; QUALITATIVE ASSESSMENTS; RELEASE METHODS; RESIDUAL STRESS GRADIENTS; ROTATIONAL DEFORMATION; SPRING CONSTANTS; TIME STABILITY;

ATOMIC FORCE MICROSCOPY; BENDING (DEFORMATION); FABRICATION; OPTIMIZATION; PHOTORESISTS; RESIDUAL STRESSES;

NANOCANTILEVERS;

EID: 77949902362     PISSN: 09601317     EISSN: 13616439     Source Type: Journal    
DOI: 10.1088/0960-1317/20/4/045024     Document Type: Article

References (33)

1. Binnig G, Quate C F and Gerber C 1986 Phys. Rev. Lett. 56 930
2. Gimzewski J K, Gerber C, Meyer E and Schlittler R R 1994 Chem. Phys. Lett. 217 589
3. Barnes J R, Stephenson R J, Welland M E, Gerber C and Gimzewski J K 1994 Nature 372 79
4. Thundat T, Warmack R J, Chen G Y and Allison D P 1994 Appl. Phys. Lett. 64 2894
5. Thundat T, Chen G Y, Warmack R J, Allison D P and Wachter E A 1995 Anal. Chem. 67 519
6. Senz J J, García N, Grütter P, Meyer E, Heinzelmann H, Wiesendanger R, Rosenthaler L, Hidber H R and Güntherodt H J 1987 J. Appl. Phys. 62 4293
7. Chen G Y, Thundat T, Wachter E A and Warmack R J 1995 J. Appl. Phys. 77 3618
8. Butt H J 1996 J. Colloid Interface Sci. 180 251
9. O'Shea S J, Welland M E, Brunt T A, Ramadan A R and Rayment T 1996 J. Vac. Sci. Technol. B 14 1383
10. Baselt D R, Lee G U and Colton R J 1996 J. Vac. Sci. Technol. B 14 789
11. Wang X, Ryu K S, Bullen D A, Zou J, Zhang H, Mirkin C A and Liu C 2003 Langmuir 19 8951
12. Gaitas A and Gianchandani Y B 2006 Ultramicroscopy 106 874
13. McFarland A W, Poggi M A, Bottomley L A and Colton J S 2004 Rev. Sci. Instrum. 75 2756
14. McFarland A W, Poggi M A, Bottomley L A and Colton J S 2004 Nanotechnology 15 1628
15. Genolet G, Brugger J, Despont M, Drechsler U, Vettiger P, de Rooij N F and Anselmetti D 1999 Rev. Sci. Instrum. 70 2398
16. Calleja M, Tamayo J, Johansson A, Rasmussen P, Lechuga L M and Boisen A 2003 Sensors Lett. 1 20
17. Ransley J H T, Watari M, Sukumaran D, McKendry R A and Seshia A A 2006 Microelectron. Eng. 83 1621
18. Mouaziz S, Boero G, Popovic R S and Brugger J A B J 2006 J. Microelectromech. Syst. 15 890
19. Fang W and Wickert J A 1996 J. Micromech. Microeng. 6 301
20. Sameoto D, Tsang S H, Foulds I G, Lee S W and Parameswaran M 2007 J. Micromech. Microeng. 17 1093
21. Keller S, Blagoi G, Lillemose M, Haefliger D and Boisen A 2008 J. Micromech. Microeng. 18 125020
22. Haefliger D, Nordstrom M, Rasmussen P A and Boisen A 2005 Microelectron. Eng. 78-79 88
23. Keller S, Haefliger D and Boisen A 2007 J. Vac. Sci. Technol. B 25 1903
24. Hopcroft M, Kramer T, Kim G, Takashima K, Higo Y, Moore D and Brugger J 2005 Fatigue Fract. Eng. Mater. Struct. 28 735
25. Luo C, Schneider T W, White R C, Currie J and Paranjape M 2003 J. Micromech. Microeng. 13 129
26. Feng R and Farris R J 2003 J. Micromech. Microeng. 13 80
27. Lian K, Ling Z-g and Liu C 2003 Reliability, Testing, and Characterization of MEMS/MOEMS II (San Jose, CA: SPIE) p 208
28. Foulds I G, Johnstone R W and Parameswaran M 2008 J. Micromech. Microeng. 18 075011
29. Tan T L, Wong D, Lee P, Rawat R S and Patran A 2004 Appl. Spectrosc. 58 1288
30. Lee K Y, LaBianca N, Rishton S A, Zolgharnain S, Gelorme J D, Shaw J and Chang T H P 1995 J. Vac. Sci. Technol. B 13 3012
31. Shaw M, Nawrocki D, Hurditch R and Johnson D 2003 Microsyst. Technol. 10 1
32. Anhoj T A, Jorgensen A M, Zauner D A and Hubner J 2006 J. Micromech. Microeng. 16 1819
33. Motahhari S and Cameron J 1999 J. Reinf. Plast. Compos. 18 1011