Nanoindentation study of thin plasma enhanced chemical vapor deposition SiCOH low- k films modified in He/ H2 downstream plasma

Journal of Vacuum Science and Technology B

Volumn 28, Issue 1, 2010, Pages 173-179

  Vanstreels, Kris ^a   Urbanowicz, Adam M ^a,b  

^a IMEC   (Belgium)

^b UNIVERSITY OF LEUVEN   (Belgium)

Author keywords

[No Author keywords available]

Indexed keywords

PLASMA CVD; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION; POROSITY; SILICON COMPOUNDS; STIFFNESS;

CONTINUOUS STIFFNESS MEASUREMENT; DOWN-STREAM PLASMAS; LOW-K FILMS; MEASUREMENT TECHNIQUES; NANO INDENTATION; NANO-INDENTATION MEASUREMENTS; POROGENS; ULTRAVIOLET CURING; ULTRAVIOLET-CURING;

NANOINDENTATION;

EID: 77949363953     PISSN: 10711023     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.3293200     Document Type: Conference Paper

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