Chemical-mechanical polishing of low-dielectric-constant spin-on-glasses: Film chemistries, slurry formulation and polish selectivity

Thin Solid Films

Volumn 308-309, Issue 1-4, 1997, Pages 550-554

  Wang, Y L ^a,d   Liu, C ^b   Chang, S T ^a   Tsai, M S ^c   Feng, M S ^a   Tseng, W T ^c  

^a NATIONAL CHIAO TUNG UNIVERSITY   (Taiwan)

^b PHOENIX SILICON INTERNATIONAL CORPORATION   (Taiwan)

^c NATIONAL NANO DEVICE LABORATORIES   (Taiwan)

^d TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY   (Taiwan)

Author keywords

Chemical mechanical polishing; Slurry; Spin on glass; Zirconia oxide

Indexed keywords

ADDITIVES; ATOMIC FORCE MICROSCOPY; CHEMICAL POLISHING; FOURIER TRANSFORM INFRARED SPECTROSCOPY; PERMITTIVITY; POTASSIUM COMPOUNDS; SILICA; SLURRIES; ZIRCONIA;

CHEMICAL MECHANICAL POLISHING (CMP); SPIN ON GLASS (SOG);

THIN FILMS;

EID: 0031249741     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0040-6090(97)00491-4     Document Type: Article

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