Substrate effects on nanoindentation mechanical property measurement of soft films on hard substrates

Journal of Materials Research

Volumn 14, Issue 1, 1999, Pages 292-301

  Tsui, T Y ^a   Pharr, G M ^a  

^a The NanoCarbon Center and Welch Institute for Advanced Materials   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM; ATOMIC FORCE MICROSCOPY; ELASTIC MODULI; GLASS; HARDNESS TESTING; MECHANICAL VARIABLES MEASUREMENT; SCANNING ELECTRON MICROSCOPY; SPUTTER DEPOSITION; SUBSTRATES; THIN FILMS;

NANOINDENTATION TESTS;

METALLIC FILMS;

EID: 0032647950     PISSN: 08842914     EISSN: None     Source Type: Journal    
DOI: 10.1557/JMR.1999.0042     Document Type: Article

References (7)

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2. W. C. Oliver, C. J. McHargue, and S. J. Zinkle, Thin Sol. Films 153, 185 (1987).
3. W. C. Oliver and C. J. McHargue, Thin Sol. Films 161, 117 (1988).
4. W. C. Oliver, R. Hutchings, and J. B. Pethica, in Microindentation Techniques in Materials Science and Engineering, edited by P. J. Blau and B. R. Lawn (American Society for Testing and Materials, Philadelphia, PA, 1986), pp. 90-108.
5. S. M. Gorbatkin, R. L. Rhodes, T. Y. Tsui, and W. C. Oliver, Appl. Phys. Lett. 65, 2672 (1994).
6. B. D. Fabes and W. C. Oliver, in Thin Films: Stresses and Mechanical Properties II, edited by M. Doerner, W. C. Oliver, G. M. Pharr, and F. R. Brotzen (Mater. Res. Soc. Symp. Proc. 188, Pittsburgh, PA, 1990), p. 127.
7. M. F. Doerner, D. S. Gardner, and W. D. Nix, J. Mater. Res. 1, 845 (1986).