Microstructural evolution of lead-free Sn-Bi-Ag-Cu SMT joints during aging

IEEE Transactions on Advanced Packaging

Volumn 28, Issue 1, 2005, Pages 128-133

  Wu, C M Lawrence ^a   Huang, Mingliang L ^b  

^a CITY UNIVERSITY OF HONG KONG   (Hong Kong)

^b DALIAN UNIVERSITY OF TECHNOLOGY   (China)

Author keywords

Aging; Fractography; Lead free solder; Microstructural evolution; Shear strength; Sn Bi Ag Cu

Indexed keywords

AGING OF MATERIALS; CRYSTAL MICROSTRUCTURE; ENERGY DISPERSIVE SPECTROSCOPY; FRACTOGRAPHY; INTERFACES (MATERIALS); INTERMETALLICS; SCANNING ELECTRON MICROSCOPY; SHEAR STRENGTH; SURFACE MOUNT TECHNOLOGY; TIN ALLOYS;

LEAD-FREE SOLDER; MICROSTRUCTURAL EVOLUTION;

SOLDERING ALLOYS;

EID: 13944257723     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/TADVP.2004.841660     Document Type: Article

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