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Volumn 75, Issue 4, 2004, Pages 375-382

Fabrication of built-in copper microstructures on epoxy resin

Author keywords

Copper; Electroless plating; Microstructure; Self assembled monolayer; Transfer; Vacuum ultraviolet

Indexed keywords

COPPER; DEPOSITION; ELECTROLESS PLATING; IRRADIATION; MICROSTRUCTURE; MONOLAYERS; SELF ASSEMBLY;

EID: 7644220151     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2004.07.059     Document Type: Article
Times cited : (9)

References (33)


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.