Characterization of electrolessly deposited copper and nickel nanofilms on modified Si(100) surface

Langmuir

Volumn 19, Issue 17, 2003, Pages 6802-6806

  Zhang, Yan ^a   Ang, S S ^a   Tay, Andrew A O ^a   Xu, Dan ^a   Kang, E T ^a   Neoh, K G ^a   Chong, Lim Poh ^b   Huan, A C H ^b  

^a NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

^b INSTITUTE OF MATERIALS RESEARCH AND ENGINEERING   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

ATOMIC FORCE MICROSCOPY; ELECTROLESS PLATING; GRAIN SIZE AND SHAPE; TRANSMISSION ELECTRON MICROSCOPY; ULTRATHIN FILMS; X RAY ANALYSIS;

METAL CLUSTERS;

NANOSTRUCTURED MATERIALS;

EID: 0041387388     PISSN: 07437463     EISSN: None     Source Type: Journal    
DOI: 10.1021/la034087o     Document Type: Article

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