PECVD of transition metals for the production of high-density circuits

Surface and Coatings Technology

Volumn 116-119, Issue , 1999, Pages 886-890

  Heinz, R ^a   Klusmann, E ^a   Meyer, H ^a   Schulz, R ^a  

^a ATOTECH DEUTSCHLAND GMBH   (Germany)

Author keywords

Adhesion; Direct metallization of polymers; Electroplating; High density interconnects; Micro roughness; PECVD; Printed circuit board

Indexed keywords

ADHESION; ELECTROPLATING; INTERFACES (MATERIALS); METALLIZING; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION; PRINTED CIRCUIT MANUFACTURE; SURFACE ROUGHNESS; TRANSITION METALS;

HIGH-DENSITY INTERCONNECTS (HDI);

PRINTED CIRCUIT BOARDS;

EID: 0033326959     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0257-8972(99)00200-5     Document Type: Article

References (7)

1. zur Nieden T. Circuit World. 21:(1):1994;18-23.
2. Lau J.H. Ball Grid Array Technology. 1995;McGraw-Hill, New York.
3. Holden H. Circuit World. 23:(2):1997;14-21.
4. Garrou P.E., Turlik I. Multichip Module Technology Handbook. 1998;McGraw-Hill, New York.
5. Hanke H.J. Baugruppentechnologie der Elektronik - Leiterplatten. 1994;Verlag Technik, Berlin. Chap. 4.
6. US Patent 4,717,587.
7. Guiles C.L., Kyle P.E., Fuller R. Entering the Information Superhighway with Multilayerable Low Loss Materials. Proc. IPC EXPO 97, 9-13 March, 1997, San Jose, CA. 1997;S1-3-2-S1-3-7.