An approach to the development of organic additives for electrodeposition of narrow copper interconnects

Journal of the Electrochemical Society

Volumn 153, Issue 7, 2006, Pages

  Lee, Jinhan ^a   Lee, Jungju ^a   Bae, Jonghak ^a   Bang, Wonbae ^a   Hong, Kimin ^a   Lee, M H ^b   Pyo, Sung G ^b   Kim, Sibum ^b   Kim, Jin Gyu ^c  

^a Chungnam National University   (South Korea)

^b MagnaChip Semiconductor Ltd   (South Korea)

^c Korea Basic Science Institute (KBSI)   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ADDITIVES; COPPER; ELECTRIC CONDUCTIVITY; ORGANIC COMPOUNDS; SALTS; SODIUM COMPOUNDS;

COPPER INTERCONNECTS; DISODIUM SALT; ELECTROCHEMICAL PROPERTIES; ORGANIC ADDITIVES;

ELECTRODEPOSITION;

EID: 33744824111     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.2203098     Document Type: Article

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